探索Nexperia豐富的核心半導體產(chǎn)品組合，這些產(chǎn)品為全球幾乎所有商用電子設計的基礎(chǔ)功能提供支持——涵蓋汽車、工業(yè)、移動及消費類應用領(lǐng)域。

所有產(chǎn)品

種類繁多的雙極晶體管助您輕松滿足系統(tǒng)需求。產(chǎn)品線涵蓋基礎(chǔ)雙極晶體管模塊，以及一系列節(jié)省空間和成本的帶電阻晶體管，直至我們突破性的小信號系列低壓降電壓器件。

二極管

我們豐富的二極管產(chǎn)品組合為您提供當今市場所需的靈活性——無論是簡單的齊納二極管、高效的肖特基整流器、快速恢復二極管還是可控雪崩開關(guān)二極管。

ESD保護、TVS、信號調(diào)節(jié)

涵蓋靜電放電保護、瞬態(tài)電壓抑制器件、共模扼流圈及電磁干擾濾波器，Nexperia的保護技術(shù)持續(xù)升級，在業(yè)界最小封裝中提供最高級別的防護。

MOSFET

Nexperia提供種類豐富的低/中壓（12-200 V）P溝道和N溝道硅MOSFET產(chǎn)品組合，采用多種節(jié)省空間且高效的封裝方案。

SiC MOSFETs

Nexperia的1200V碳化硅（SiC）MOSFET重新定義了安全、穩(wěn)健且可靠的電源開關(guān)標準，成為電動汽車充電基礎(chǔ)設施、光伏逆變器及電機驅(qū)動領(lǐng)域的首選產(chǎn)品。
- 1200 V SiC MOSFETs

氮化鎵場效應晶體管(GaN FET)

針對各類高壓（650 V）和低壓（40-150 V）應用場景，Nexperia氮化鎵場效應晶體管憑借更低的導通損耗與開關(guān)損耗，實現(xiàn)了最快速的過渡/開關(guān)能力、最佳的功率效率以及更高的功率密度。

絕緣柵雙極晶體管(IGBTs)

為滿足高效高壓電源轉(zhuǎn)換和電機驅(qū)動日益增長的需求，Nexperia的IGBT采用堅固且經(jīng)濟高效的載流子存儲溝槽柵極（CSTBT）先進場截止（FS）結(jié)構(gòu)。
- 650 / 1200 V discrete IGBTs

模擬和邏輯IC

除全面的邏輯功能、模擬開關(guān)和I2C接口產(chǎn)品組合外，Nexperia還提供日益豐富的功率IC產(chǎn)品線，助力打造創(chuàng)新解決方案，專注于降低客戶物料清單成本，提升系統(tǒng)效率與可靠性。

汽車

為助力實現(xiàn)互聯(lián)電動及混合動力車輛，Nexperia半導體提供全系列符合AEC-Q100/Q101認證的器件，涵蓋我們完整的產(chǎn)品組合，這些產(chǎn)品兼具高效能與高效設計特性。

應用

所有應用

秉承創(chuàng)新與可持續(xù)發(fā)展的理念，我們的組件在效率方面樹立了行業(yè)標桿，助力全球客戶為世界各地幾乎所有商用電子設計開發(fā)節(jié)能高效的尖端解決方案

所有應用

汽車

當今汽車正經(jīng)歷著該行業(yè)有史以來最重大的變革。持續(xù)推進的電氣化進程正引發(fā)從動力總成到云端系統(tǒng)的深刻變革，越來越多的電子功能被引入以提升安全性和舒適性。

工業(yè)和電力

從工業(yè)自動化到可再生能源及電動出行解決方案，Nexperia憑借久經(jīng)考驗的品質(zhì)、穩(wěn)定的大規(guī)模供應、終身可靠性與產(chǎn)品長壽命特性，助力工業(yè)持續(xù)運轉(zhuǎn)。

移動和可穿戴應用

智能手機已牢牢扎根于我們的生活——它們是獲取信息、社交聯(lián)絡、娛樂消遣以及銀行服務到卡路里計算等全方位服務的不可或缺工具。但要實現(xiàn)這些功能，手機需要采用占用電路板空間小、能延長電池續(xù)航時間并支持復雜功能的組件。

計算和消費電子

當我們想到計算和消費類應用時，往往會聯(lián)想到筆記本電腦和洗衣機。然而當今的應用已催生出一大批創(chuàng)新產(chǎn)品——從掃地機器人到自動充電遙控器。

子系統(tǒng)：電源轉(zhuǎn)換拓撲結(jié)構(gòu)

幾乎所有電子設備都依賴某種形式的電源轉(zhuǎn)換。無論是將交流電網(wǎng)電源轉(zhuǎn)換為直流電源軌，提升直流電池電壓，還是簡單地處理當今電子系統(tǒng)中日益多樣化的電源軌。

子系統(tǒng)

任何復雜系統(tǒng)均可分解為若干子系統(tǒng)，這些子系統(tǒng)可應用于眾多領(lǐng)域。從電機驅(qū)動器和電源裝置到用于穩(wěn)定驅(qū)動LED燈串的恒流源，這些子系統(tǒng)之間的唯一區(qū)別在于其規(guī)格參數(shù)和整體效率。

參考設計

探索我們豐富的Nexperia參考設計及第三方評估板與參考設計系列。這些解決方案采用最先進的半導體技術(shù)，提供完整的系統(tǒng)、子系統(tǒng)及專業(yè)功能，可無縫集成至您的項目中。

全部參考設計

評估板

深入了解我們的產(chǎn)品如何為您的應用帶來益處——無論是優(yōu)化效率、增強穩(wěn)健性還是提升可靠性，只需親自嘗試我們?nèi)娴脑u估板系列即可。

全部評估板

交互式應用說明

Nexperia交互式應用說明采用PartQuest Explore仿真技術(shù)，將傳統(tǒng)書面應用說明賦予生動呈現(xiàn)。通過嵌入式仿真技術(shù)，為各類電源設計與拓撲結(jié)構(gòu)提供指導方案，顯著提升用戶體驗。

進階輔助工具

Nexperia不僅致力于開發(fā)高性能功率產(chǎn)品和創(chuàng)新功率技術(shù)，更致力于打造最先進的工具，為設計工程師提供知識、學習資源和技術(shù)支持。

質(zhì)量

支持

商店

工作機會

關(guān)于我們

新聞

博客

化學成分 PIMP31PA

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù)，這是安世半導體為半導體產(chǎn)業(yè)設下的一個行業(yè)標準。安世半導體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934666067115	PIMP31PAX	PIMP31PA	SOT1118 (HUSON6)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 14946 ppm; substance 1333-86-4: 2761 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 14946 ppm; substance 1333-86-4: 2761 ppm; substance 7439-92-1: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 8864 ppm; substance 7440-05-3: 269 ppm; substance 7440-57-5: 5008 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.062400	80.000000	0.886399
Adhesive	Polymer	Poly(isobornyl) methacrylate	64114-51-8	0.007800	10.000000	0.110800
Adhesive	Polymer	Bismaleimide resin		0.006825	8.750000	0.096950
Adhesive	Polymer	Polysiloxanes	63148-53-8	0.000780	1.000000	0.011080
Adhesive	Polymer	Acrylic resin		0.000187	0.240000	0.002656
Adhesive	Curing accelerators/Catalyst	Palladium (Pd)	7440-05-3	0.000008	0.010000	0.000114
		Adhesive Total		0.078000	100.000000	1.107999

Die	Doped silicon	Silicon (Si)	7440-21-3	0.184000	100.000000	2.613740
		Die Total		0.184000	100.000000	2.613740

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.559410	95.110000	36.356702
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.085305	3.170000	1.211767
Lead Frame	Copper alloy	Silicon (Si)	7440-21-3	0.018568	0.690000	0.263761
Lead Frame	Copper alloy	Magnesium (Mg)	7439-95-4	0.005382	0.200000	0.076452
		Base Alloy C70250 Total		2.668665	99.170000	37.908682
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.019913	0.740000	0.282866
		Pre-Plating 1 Total		0.019913	0.740000	0.282866
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.001884	0.070000	0.026762
		Pre-Plating 2 Total		0.001884	0.070000	0.026762
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.000538	0.020000	0.007642
		Pre-Plating 3 Total		0.000538	0.020000	0.007642
		Lead Frame Total		2.691000	100.000000	38.225952

Mould Compound	Filler	Silica fused	60676-86-0	2.332800	60.000000	33.137682
Mould Compound	Filler	Silica	7631-86-9	0.894240	23.000000	12.702778
Mould Compound	Polymer	Epoxy resin system		0.272160	7.000000	3.866063
Mould Compound	Polymer	Phenolic resin		0.233280	6.000000	3.313768
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.116640	3.000000	1.656884
Mould Compound	Ion trapping agent	Bismuth (Bi)	7440-69-9	0.019440	0.500000	0.276147
Mould Compound	Pigment	Carbon black	1333-86-4	0.019440	0.500000	0.276147
		Mould Compound Total		3.888000	100.000000	55.229469

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.163902	99.940000	2.328246
Post-Plating	Impurity	Non-declarable		0.000091	0.055500	0.001293
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000007	0.004500	0.000099
		Post-Plating Total		0.164000	100.000000	2.329638

Wire	Pure metal	Gold (Au)	7440-57-5	0.034717	99.990000	0.493159
Wire	Impurity	Non-declarable		0.000003	0.010000	0.000043
		Wire Total		0.034720	100.000000	0.493202

		PIMP31PA Total		7.039720		100.000000

Notes
Report created on 2025-11-03 10:37:36 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-11-03 10:37:36 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
預鍍層3 (Pre-Plating 3)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-11-03 10:37:36 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產(chǎn)品(AEC-Q100/Q101)

化學成分 PIMP31PA

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護