74LVC1G08-Q100
Single 2-input AND gate
The 74LVC1G08-Q100 is a single 2-input AND gate. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V applications.
Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall time.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
High noise immunity
±24 mA output drive (VCC = 3.0 V)
CMOS low power dissipation
Direct interface with TTL levels
Overvoltage tolerant inputs to 5.5 V
IOFF circuitry provides partial Power-down mode operation
Latch-up performance ≤ 250 mA
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD36 (4.5 V to 5.5 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G08GM-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | 313 | 7.8 | 158 | XSON6 |
| 74LVC1G08GS-Q100 | XSON6 | |||||||||||
| 74LVC1G08GV-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | 270 | 63.3 | 169 | TSOP5 |
| 74LVC1G08GW-Q100 | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | 311 | 80.9 | 181 | TSSOP5 |
| 74LVC1G08GZ-Q100 | 1.65?-?5.5 | CMOS/LVTTL | low | -40~125 | XSON5 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G08GM-Q100 | 74LVC1G08GM‑Q100X (935690713115) |
Active | VE |
XSON6 (SOT886) |
SOT886 | SOT886_115 | |
| 74LVC1G08GS-Q100 | 74LVC1G08GS‑Q100H (935692489125) |
Active | VE |
XSON6 (SOT1202) |
SOT1202 | 暫無信息 | |
| 74LVC1G08GV-Q100 | 74LVC1G08GV‑Q100,1 (935298475125) |
Active | V08 |
TSOP5 (SOT753) |
SOT753 |
WAVE_BG-BD-1
|
SOT753_125 |
| 74LVC1G08GW-Q100 | 74LVC1G08GW‑Q100,1 (935298476125) |
Active | VE |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74LVC1G08GZ-Q100 | 74LVC1G08GZ‑Q100YL (935691687315) |
Active | VE |
XSON5 (SOT8065-1) |
SOT8065-1 | SOT8065-1_315 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G08GM-Q100 | 74LVC1G08GM‑Q100X | 74LVC1G08GM-Q100 |
|
|
| 74LVC1G08GS-Q100 | 74LVC1G08GS‑Q100H | 74LVC1G08GS-Q100 |
|
|
| 74LVC1G08GV-Q100 | 74LVC1G08GV‑Q100,1 | 74LVC1G08GV-Q100 |
|
|
| 74LVC1G08GW-Q100 | 74LVC1G08GW‑Q100,1 | 74LVC1G08GW-Q100 |
|
|
| 74LVC1G08GZ-Q100 | 74LVC1G08GZ‑Q100YL | 74LVC1G08GZ-Q100 |
|
|
文檔 (28)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC1G08_Q100 | Single 2-input AND gate | Data sheet | 2025-07-15 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| mna113 | Block diagram: 74AHC1G08GV, 74AHC1G08GW, 74AHCT1G08GV, 74AHCT1G08GW, 74HC1G08GV, 74HC1G08GW, 74HCT1G08GV, 74HCT1G08GW, 74LVC1G08GF, 74LVC1G08GM, 74LVC1G08GV, 74LVC1G08GW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| lvc1g08 | 74LVC1G08 IBIS model | IBIS model | 2014-10-20 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Leaflet_SOT8065_Minilogic | Leaflet_SOT8065 Minilogic | Leaflet | 2024-11-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-08-28 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| lvc1g08 | 74LVC1G08 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
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