LSF0108-Q100
8-bit bidirectional multi-voltage level translator; open-drain; push-pull
The LSF0108-Q100 is an 8 Channel bidirectional multi-voltage level translator for open-drain and push?-?pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0108-Q100 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +125 °C
Bidirectional voltage translation with no direction pin
Up translation
≤ 100 MHz; CL = 30 pF
≤ 50 MHz; CL = 50 pF
Down translation
≥ 100 MHz; CL = 30 pF
≥ 50 MHz; CL = 50 pF
Hot insertion
Bidirectional voltage level translation between:
0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
1.8 V and 2.5 V, 3.3 V and 5.0 V
2.5 V and 3.3 V and 5.0 V
3.3 V and 5.0 V
Low standby current
5 V tolerant I/O pins to support TTL
Low RON provides less signal distortion
High-impedance I/O pins for EN = Low.
Flow-through pinout for easy PCB trace routing.
Latch-up performance exceeds 100 mA per JESD78 class II level A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
Applications
GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure
Industrial
Personal computing
Automotive
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LSF0108BQ-Q100 | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 1.4 | 8 | low | -40~125 | 77 | 8.7 | 49 | DHVQFN20 | Bi-directional | AutoSense |
| LSF0108PW-Q100 | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 1.4 | 8 | low | -40~125 | 100 | 4.5 | 45 | TSSOP20 | Bi-directional | AutoSense |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| LSF0108BQ-Q100 | LSF0108BQ‑Q100X (935690919115) |
Active | LSF0108 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| LSF0108PW-Q100 | LSF0108PW‑Q100J (935690918118) |
Active | LSF0108 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| LSF0108BQ-Q100 | LSF0108BQ‑Q100X | LSF0108BQ-Q100 |
|
|
| LSF0108PW-Q100 | LSF0108PW‑Q100J | LSF0108PW-Q100 |
|
|
文檔 (12)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| LSF0108_Q100 | 8-bit bidirectional multi-voltage level translator; open-drain; push-pull | Data sheet | 2024-07-25 |
| AN90050 | Pin FMEA for LSF family | Application note | 2023-12-14 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lsf0108 | LSF0108 IBIS model | IBIS model | 2020-04-14 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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Ordering, pricing & availability
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