74ABT74
Dual D-type flip-flop with set and reset; positive edge-trigger
The 74ABT74 is a dual positive edge triggered D-type flip-flop with individual data (D), clock (CP), set (SD) and reset (RD) inputs, and complementary Q and Q outputs. Data at the D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition will be stored in the flip-flop and appear at the Q output. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Supply voltage range from 4.5 V to 5.5 V
BiCMOS high speed and output drive
Direct interface with TTL levels
Power-up 3-state
IOFF circuitry provides partial Power-down mode operation
Latch-up protection exceeds 500 mA per JESD78B class II level A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74ABT74D | 4.5?-?5.5 | TTL | -15/+20 | 3.0 | 250 | medium | -40~85 | 106 | 18.9 | 64 | SO14 |
| 74ABT74PW | 4.5?-?5.5 | TTL | -15/+20 | 3.0 | 250 | medium | -40~85 | 140 | 7.4 | 66 | TSSOP14 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ABT74D | 74ABT74D,118 (935208740118) |
Active | 74ABT74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74ABT74PW | 74ABT74PW,118 (935208760118) |
Active | ABT74 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ABT74DB | 74ABT74DB,112 (935208750112) |
Obsolete | no package information | ||||
| 74ABT74DB,118 (935208750118) |
Obsolete | ||||||
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74ABT74 | Dual D-type flip-flop with set and reset; positive edge-trigger | Data sheet | 2024-01-23 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| sf00048 | Block diagram: 74ABT74D, 74ABT74DB, 74ABT74N, 74ABT74PW, 74LVT74D, 74LVT74DB, 74LVT74PW, I74F74D, I74F74N, N74F74D, N74F74N | Block diagram | 2009-11-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| abt74 | abt74 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| abt | abt Spice model | SPICE model | 2013-05-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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