74AHC74; 74AHCT74
Dual D-type flip-flop with set and reset; positive-edge trigger
The 74AHC74; 74AHCT74 is a high-speed Si-gate CMOS device and is pin compatible with Low?-?Power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.
The 74AHC74; 74AHCT74 is a dual positive-edge triggered, D-type flip-flop with individual data inputs (D), clock inputs (CP), set inputs (SD) and reset inputs (RD). It also has complementary outputs (Q and Q).
The set and reset are asynchronous active LOW inputs that operate independent of the clock input. Information on the data input is transferred to the Q output on the LOW to HIGH transition of the clock pulse. The data inputs must be stable one set-up time prior to the LOW to HIGH clock transition for predictable operation.
Schmitt-trigger action in the clock input makes the circuit highly tolerant to slower clock rise and fall times.
Features and benefits
Balanced propagation delays
All inputs have Schmitt-trigger actions
Inputs accept voltages higher than VCC
Input levels:
For 74AHC74: CMOS level
For 74AHCT74: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC74BQ | 2.0?-?5.5 | CMOS | ± 8 | 3.7 | 170 | low | -40~125 | 106 | 20.9 | 74 | DHVQFN14 |
| 74AHC74BZ | 2.0?-?5.5 | ± 8 | CMOS | 3.7 | 170 | low | -40~125 | DHXQFN14 | |||
| 74AHC74D | 2.0?-?5.5 | CMOS | ± 8 | 3.7 | 170 | low | -40~125 | 108 | 20.1 | 66 | SO14 |
| 74AHC74PW | 2.0?-?5.5 | CMOS | ± 8 | 3.7 | 170 | low | -40~125 | 141 | 7.8 | 68 | TSSOP14 |
| 74AHCT74BQ | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 160 | low | -40~125 | 106 | 20.9 | 74 | DHVQFN14 |
| 74AHCT74BZ | 4.5?-?5.5 | ± 8 | TTL | 3.3 | 160 | low | -40~125 | DHXQFN14 | |||
| 74AHCT74D | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 160 | low | -40~125 | 108 | 20.1 | 66 | SO14 |
| 74AHCT74PW | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 160 | low | -40~125 | 141 | 7.8 | 68 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC74BQ | 74AHC74BQ,115 (935278807115) |
Active | AHC74 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHC74BZ | 74AHC74BZZ (935692209147) |
Active | A74 |
DHXQFN14 (SOT8014-1) |
SOT8014-1 | SOT8014-1_147 | |
| 74AHC74D | 74AHC74D,118 (935263078118) |
Active | 74AHC74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHC74PW | 74AHC74PW,118 (935263079118) |
Active | AHC74 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74AHCT74BQ | 74AHCT74BQ,115 (935278809115) |
Active | AHT74 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHCT74BZ | 74AHCT74BZZ (935692200147) |
Active | C74 |
DHXQFN14 (SOT8014-1) |
SOT8014-1 | SOT8014-1_147 | |
| 74AHCT74D | 74AHCT74D,118 (935263076118) |
Active | 74AHCT74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHCT74PW | 74AHCT74PW,118 (935263077118) |
Active | AHCT74 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC74BQ | 74AHC74BQ,115 | 74AHC74BQ |
|
|
| 74AHC74BZ | 74AHC74BZZ | 74AHC74BZ |
|
|
| 74AHC74D | 74AHC74D,118 | 74AHC74D |
|
|
| 74AHC74PW | 74AHC74PW,118 | 74AHC74PW |
|
|
| 74AHCT74BQ | 74AHCT74BQ,115 | 74AHCT74BQ |
|
|
| 74AHCT74BZ | 74AHCT74BZZ | 74AHCT74BZ |
|
|
| 74AHCT74D | 74AHCT74D,118 | 74AHCT74D |
|
|
| 74AHCT74PW | 74AHCT74PW,118 | 74AHCT74PW |
|
|
文檔 (21)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT74 | Dual D-type flip-flop with set and reset; positive-edge trigger | Data sheet | 2025-04-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| mna421 | Block diagram: 74AHC74BQ, 74AHC74D, 74AHC74PW, 74AHCT74BQ, 74AHCT74D, 74AHCT74PW, 74LVC2G74DC, 74LVC2G74DP, 74LVC2G74GD, 74LVC2G74GM, 74LVC2G74GT | Block diagram | 2009-11-03 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT8014-1 | 3D model for products with SOT8014-1 package | Design support | 2023-02-02 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc74 | ahc74 IBIS model | IBIS model | 2013-04-08 |
| ahct74 | ahct74 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT8014-1 | 3D model for products with SOT8014-1 package | Design support | 2023-02-02 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc74 | ahc74 IBIS model | IBIS model | 2013-04-08 |
| ahct74 | ahct74 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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