74LVC1G175
Single D-type flip-flop with reset; positive-edge trigger
The 74LVC1G175 is a low-power, low-voltage single positive edge triggered D-type flip-flop with individual data (D) input, clock (CP) input, master reset (MR) input, and Q output.
The master reset (MR) is an asynchronous active LOW input and operates independently of the clock input. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The D input must be stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation.
The inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times.
Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
High noise immunity
Overvoltage tolerant inputs to 5.5 V
±24 mA output drive (VCC = 3.0 V)
CMOS low power dissipation
Direct interface with TTL levels
IOFF circuitry provides partial Power-down mode operation
Latch-up performance exceeds 250 mA
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD36 (4.5 V to 5.5 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C.
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G175GM | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 3.1 | 300 | low | -40~125 | 291 | 6.6 | 145 | XSON6 |
| 74LVC1G175GN | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 3.1 | 300 | low | -40~125 | 277 | 12.1 | 172 | XSON6 |
| 74LVC1G175GS | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 3.1 | 300 | low | -40~125 | 273 | 15.3 | 178 | XSON6 |
| 74LVC1G175GV | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 3.1 | 300 | low | -40~125 | 232 | 40 | 146 | TSOP6 |
| 74LVC1G175GW | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 3.1 | 300 | low | -40~125 | 265 | 39.1 | 154 | TSSOP6 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G175GM | 74LVC1G175GM,115 (935277208115) |
Active | YT |
XSON6 (SOT886) |
SOT886 | SOT886_115 | |
| 74LVC1G175GM,132 (935277208132) |
Active | YT | SOT886_132 | ||||
| 74LVC1G175GN | 74LVC1G175GN,132 (935291779132) |
Active | YT |
XSON6 (SOT1115) |
SOT1115 | SOT1115_132 | |
| 74LVC1G175GS | 74LVC1G175GS,132 (935292905132) |
Active | YT |
XSON6 (SOT1202) |
SOT1202 | SOT1202_132 | |
| 74LVC1G175GV | 74LVC1G175GV,125 (935274947125) |
Active | V75 |
TSOP6 (SOT457) |
SOT457 |
WAVE_BG-BD-1
|
SOT457_125 |
| 74LVC1G175GW | 74LVC1G175GW,125 (935274948125) |
Active | YT |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G175GF | 74LVC1G175GF,132 (935282414132) |
Obsolete | YT |
XSON6 (SOT891) |
SOT891 | SOT891_132 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G175GM | 74LVC1G175GM,115 | 74LVC1G175GM |
|
|
| 74LVC1G175GM | 74LVC1G175GM,132 | 74LVC1G175GM |
|
|
| 74LVC1G175GN | 74LVC1G175GN,132 | 74LVC1G175GN |
|
|
| 74LVC1G175GS | 74LVC1G175GS,132 | 74LVC1G175GS |
|
|
| 74LVC1G175GV | 74LVC1G175GV,125 | 74LVC1G175GV |
|
|
| 74LVC1G175GW | 74LVC1G175GW,125 | 74LVC1G175GW |
|
|
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G175GF | 74LVC1G175GF,132 | 74LVC1G175GF |
|
|
文檔 (32)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC1G175 | Single D-type flip-flop with reset; positive-edge trigger | Data sheet | 2023-08-15 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| 001aaa466 | Block diagram: 74LVC1G175GF, 74LVC1G175GM, 74LVC1G175GV, 74LVC1G175GW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g175 | 74LVC1G175 IBIS model | IBIS model | 2014-10-20 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g175 | 74LVC1G175 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
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