74AVC4T774
4-bit dual supply translating transceiver; 3-state
The 74AVC4T774 is a 4-bit, dual supply transceiver that enables bidirectional level translation. It features eight 1-bit input-output ports (An and Bn), four direction control inputs (DIR1, DIR2, DIR3 and DIR4), an output enable input (OE) and dual supply pins (VCC(A) and VCC(B)). Both VCC(A) and VCC(B) can be supplied at any voltage between 0.8 V and 3.6 V making the device suitable for translating between any of the low voltage nodes (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V). Pins An, OE and DIRn are referenced to VCC(A) and pins Bn are referenced to VCC(B). A HIGH on DIRn allows transmission from An to Bn and a LOW on DIRn allows transmission from Bn to An. The output enable input (OE) can be used to disable the outputs so the buses are effectively isolated.
The device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down. In suspend mode when either VCC(A) or VCC(B) are at GND level, both An and Bn are in the high-impedance OFF-state.
Features and benefits
Wide supply voltage range:
VCC(A): 0.8 V to 3.6 V
VCC(B): 0.8 V to 3.6 V
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
Maximum data rates:
380 Mbit/s (≥ 1.8 V to 3.3 V translation)
200 Mbit/s (≥ 1.1 V to 3.3 V translation)
200 Mbit/s (≥ 1.1 V to 2.5 V translation)
200 Mbit/s (≥ 1.1 V to 1.8 V translation)
150 Mbit/s (≥ 1.1 V to 1.5 V translation)
100 Mbit/s (≥ 1.1 V to 1.2 V translation)
Suspend mode
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
IOFF circuitry provides partial Power-down mode operation
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AVC4T774BQ | 0.8?-?3.6 | 0.8?-?3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | 92 | 13 | 61 | DHVQFN16 | Bi-directional | Direction controlled |
| 74AVC4T774BQ-Q100 | 0.8?-?3.6 | 0.8?-?3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | 92 | 13 | 61 | DHVQFN16 | Bi-directional | Direction controlled |
| 74AVC4T774GU | 0.8?-?3.6 | 0.8?-?3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | 99 | 4.1 | 87 | XQFN16 | Bi-directional | Direction controlled |
| 74AVC4T774GU-Q100 | 0.8?-?3.6 | 0.8?-?3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | 99 | 4.1 | 87 | XQFN16 | Bi-directional | Direction controlled |
| 74AVC4T774PW | 0.8?-?3.6 | 0.8?-?3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | 124 | 4.3 | 53.4 | TSSOP16 | Bi-directional | Direction controlled |
| 74AVC4T774PW-Q100 | 0.8?-?3.6 | 0.8?-?3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | 124 | 4.3 | 53.4 | TSSOP16 | Bi-directional | Direction controlled |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AVC4T774BQ | 74AVC4T774BQX (935341326115) |
Active | C4T774 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74AVC4T774BQ-Q100 | 74AVC4T774BQ‑Q100X (935691331115) |
Active | C4T774 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74AVC4T774GU | 74AVC4T774GU/G420Z (935692787184) |
Development | B77 |
XQFN16 (SOT1161-1) |
SOT1161-1 | SOT1161-1_184 | |
| 74AVC4T774GU/S500X (935690119115) |
Active | B77 | SOT1161-1_115 | ||||
| 74AVC4T774GUX (935341327115) |
Active | B77 | SOT1161-1_115 | ||||
| 74AVC4T774GUZ (935341327184) |
Active | B77 | SOT1161-1_184 | ||||
| 74AVC4T774GU-Q100 | 74AVC4T774GU‑Q100X (935691332115) |
Active | B77 |
XQFN16 (SOT1161-1) |
SOT1161-1 | SOT1161-1_115 | |
| 74AVC4T774GU‑Q100Z (935691332184) |
Active | B77 | SOT1161-1_184 | ||||
| 74AVC4T774PW | 74AVC4T774PWJ (935341328118) |
Active | VC4T774 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74AVC4T774PW-Q100 | 74AVC4T774PW‑Q100J (935691259118) |
Active | VC4T774 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AVC4T774BQ | 74AVC4T774BQX | 74AVC4T774BQ |
|
|
| 74AVC4T774BQ-Q100 | 74AVC4T774BQ‑Q100X | 74AVC4T774BQ-Q100 |
|
|
| 74AVC4T774GU | 74AVC4T774GU/G420Z | 74AVC4T774GU |
|
|
| 74AVC4T774GU | 74AVC4T774GU/S500X | 74AVC4T774GU |
|
|
| 74AVC4T774GU | 74AVC4T774GUX | 74AVC4T774GU |
|
|
| 74AVC4T774GU | 74AVC4T774GUZ | 74AVC4T774GU |
|
|
| 74AVC4T774GU-Q100 | 74AVC4T774GU‑Q100X | 74AVC4T774GU-Q100 |
|
|
| 74AVC4T774GU-Q100 | 74AVC4T774GU‑Q100Z | 74AVC4T774GU-Q100 |
|
|
| 74AVC4T774PW | 74AVC4T774PWJ | 74AVC4T774PW |
|
|
| 74AVC4T774PW-Q100 | 74AVC4T774PW‑Q100J | 74AVC4T774PW-Q100 |
|
|
文檔 (14)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AVC4T774 | 4-bit dual supply translating transceiver; 3-state | Data sheet | 2024-06-25 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT1161-1 | 3D model for products with SOT1161-1 package | Design support | 2023-02-07 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| avc4t774 | AVC4T774 IBIS model | IBIS model | 2017-10-04 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT1161-1 | plastic, leadless extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 2.6 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-15 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT1161-1 | 3D model for products with SOT1161-1 package | Design support | 2023-02-07 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| avc4t774 | AVC4T774 IBIS model | IBIS model | 2017-10-04 |
Ordering, pricing & availability
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