74AXP1G57
Low-power configurable multiple function gate
The 74AXP1G57 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer. All inputs can be connected directly to VCC or GND.
This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.7 V to 2.75 V
Low input capacitance; CI = 0.5 pF (typical)
Low output capacitance; CO = 1.0 pF (typical)
Low dynamic power consumption; CPD = 2.7 pF at VCC = 1.2 V (typical)
Low static power consumption; ICC = 0.6 μA (85 °C maximum)
High noise immunity
Complies with JEDEC standard:
JESD8-12A.01 (1.1 V to 1.3 V)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
CDM JESD22-C101E exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 2.75 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial power-down mode operation
Multiple package options
Specified from -40 °C to +85 °C
參數(shù)類型
| 型號 |
|---|
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AXP1G57GM | 74AXP1G57GMH (935301596125) |
Obsolete | no package information | ||||
| 74AXP1G57GN | 74AXP1G57GNH (935301597125) |
Obsolete | no package information | ||||
| 74AXP1G57GS | 74AXP1G57GSH (935301598125) |
Obsolete | no package information | ||||
| 74AXP1G57GX | 74AXP1G57GXH (935307074125) |
Obsolete |
X2SON6 (SOT1255-2) |
SOT1255-2 | 暫無信息 | ||
| 74AXP1G57GXZ (935307074147) |
Withdrawn / End-of-life | SOT1255-2_147 | |||||
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AXP1G57GM | 74AXP1G57GMH | 74AXP1G57GM |
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| 74AXP1G57GN | 74AXP1G57GNH | 74AXP1G57GN |
|
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| 74AXP1G57GS | 74AXP1G57GSH | 74AXP1G57GS |
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| 74AXP1G57GX | 74AXP1G57GXH | 74AXP1G57GX |
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| 74AXP1G57GX | 74AXP1G57GXZ | 74AXP1G57GX |
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文檔 (8)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AXP1G57 | Low-power configurable multiple function gate | Data sheet | 2021-10-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| axp1g57 | 74AXP1G57 IBIS model | IBIS model | 2015-09-08 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812 | Single configurable logic | Leaflet | 2019-01-04 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
支持
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Ordering, pricing & availability
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