PCMFxUSB3BA
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
Common-mode ElectroMagnetic Interference (EMI) filters with integrated bidirectional ElectroStatic Discharge (ESD) protection for one, two and three differential channels. The devices are designed to provide low insertion loss for differential high-speed signals on each channel while unwanted common-mode signals are attenuated.
Each differential channel incorporates two signal lines that are coupled by integrated coils. Diodes provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.
Type number | Number of channels | Package Name |
|---|---|---|
PCMF1USB3BA/C | 1 | WLCSP5 |
PCMF2USB3BA/C | 2 | WLCSP10 |
PCMF3USB3BA/C | 3 | WLCSP15 |
Features and benefits
One, two and three differential channels common-mode EMI filters with integrated ESD protection
ESD protection up to ±15 kV contact discharge according to IEC 61000-4-2
Superior common-mode suppression over a wide frequency range
Superior RF performance compared to other integrated filters or discrete filters with external ESD protection
Extremely high symmetry between line pairs
Industry-standard Wafer-Level Chip-Scale Packages: WLCSP5, 10 and 15 for smaller footprint
Applications
Smartphone, cellular and cordless phone
USB3.2, USB2.0, HDMI2.0, HDMI1.4
General-purpose downstream ESD protection for differential data lines
Tablet PC and Mobile Internet Device (MID)
MIPI M-PHY and D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | Configuration | Nr of lines | VRWM (V) (V) | Cd [typ] (pF) | IPPM [max] (A) | VESD (kV) (kV) |
|---|---|---|---|---|---|---|---|---|---|
| PCMF1USB3BA | WLCSP5_2-1-2 | WLCSP5 | 0.77 x 1.17 x 0.57 | Bidirectional | 2 | 4 | 0.3 | 7.5 | 15 |
| PCMF2USB3BA | WLCSP10_4-2-4 | WLCSP10 | 1.57 x 1.17 x 0.57 | Bidirectional | 4 | 4 | 0.3 | 7.5 | 15 |
| PCMF3USB3BA | WLCSP15_6-3-6 | WLCSP15 | 2.37 x 1.17 x 0.57 | Bidirectional | 6 | 4 | 0.3 | 7.5 | 15 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PCMF1USB3BA | PCMF1USB3BA/CZ (934660285087) |
Active |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | 暫無信息 | ||
| PCMF2USB3BA | PCMF2USB3BA/CZ (934660284087) |
Active |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | ||
| PCMF3USB3BA | PCMF3USB3BA/CZ (934660282087) |
Active |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PCMF1USB3BA | PCMF1USB3BA/CZ | PCMF1USB3BA |
|
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| PCMF2USB3BA | PCMF2USB3BA/CZ | PCMF2USB3BA |
|
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| PCMF3USB3BA | PCMF3USB3BA/CZ | PCMF3USB3BA |
|
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文檔 (12)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PCMFXUSB3BA_C_SER | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection | Data sheet | 2020-05-12 |
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
| Nexperia_CMF_with_ESD_protection_for_high-speed_datalines | CMF with ESD protection for high-speed data communication lines | Leaflet | 2020-04-03 |
| Nexperia_Integrated_CMF_and_ESD_protection_for_high-speed_data_lines_CN | Nexperia Integrated CMF and ESD protection for high-speed data lines CN | Leaflet | 2020-04-29 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
| WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
| WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP15_6-3-6 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Ordering, pricing & availability
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