74HC138-Q100; 74HCT138-Q100
3-to-8 line decoder/demultiplexer; inverting
The 74HC138-Q100; 74HCT138-Q100 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features three enable inputs (E1, E2 and E3). Every output will be HIGH unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion to a 1-of-32 (5 to 32 lines) decoder with just four '138 ICs and one inverter. The '138 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Demultiplexing capability
Multiple input enable for easy expansion
Ideal for memory chip select decoding
Active LOW mutually exclusive outputs
Input levels:
For 74HC138-Q100: CMOS level
For 74HCT138-Q100: TTL level
Complies with JEDEC standards:
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74HC138BQ-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | low | -40~125 | 93 | 14.3 | 63 | DHVQFN16 |
| 74HC138D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | low | -40~125 | 93 | 10 | 53 | SO16 |
| 74HC138PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | low | -40~125 | 125 | 4.7 | 55.5 | TSSOP16 |
| 74HCT138BQ-Q100 | 4.5?-?5.5 | TTL | ± 4 | 19 | low | -40~125 | 93 | 14.3 | 63 | DHVQFN16 |
| 74HCT138D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 19 | low | -40~125 | 93 | 10 | 53 | SO16 |
| 74HCT138PW-Q100 | 4.5?-?5.5 | TTL | ± 4 | 19 | low | -40~125 | 125 | 4.7 | 55.5 | TSSOP16 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC138BQ-Q100 | 74HC138BQ‑Q100,115 (935298742115) |
Active | HC138 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HC138D-Q100 | 74HC138D‑Q100,118 (935298743118) |
Active | 74HC138D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC138PW-Q100 | 74HC138PW‑Q100,118 (935298744118) |
Active | HC138 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT138BQ-Q100 | 74HCT138BQ‑Q100,11 (935298745115) |
Active | HCT138 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HCT138D-Q100 | 74HCT138D‑Q100,118 (935298746118) |
Active | 74HCT138D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HCT138PW-Q100 | 74HCT138PW‑Q100,11 (935298747118) |
Active | HCT138 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC138BQ-Q100 | 74HC138BQ‑Q100,115 | 74HC138BQ-Q100 |
|
|
| 74HC138D-Q100 | 74HC138D‑Q100,118 | 74HC138D-Q100 |
|
|
| 74HC138PW-Q100 | 74HC138PW‑Q100,118 | 74HC138PW-Q100 |
|
|
| 74HCT138BQ-Q100 | 74HCT138BQ‑Q100,11 | 74HCT138BQ-Q100 |
|
|
| 74HCT138D-Q100 | 74HCT138D‑Q100,118 | 74HCT138D-Q100 |
|
|
| 74HCT138PW-Q100 | 74HCT138PW‑Q100,11 | 74HCT138PW-Q100 |
|
|
文檔 (16)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT138_Q100 | 3-to-8 line decoder/demultiplexer; inverting | Data sheet | 2024-02-26 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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