74HC157-Q100; 74HCT157-Q100
Quad 2-input multiplexer
The 74HC157-Q100; 74HCT157-Q100 is a quad 2-input multiplexer. The device features select (S) and enable E inputs. A HIGH on S selects data source 1, a LOW data source 0. A HIGH on E forces all the outputs (1Y to 4Y) LOW. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
Input levels:
For 74HC157-Q100: CMOS level
For 74HCT157-Q100: TTL level
Non-inverting data path
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74HC157BQ-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 92 | 13.1 | 61 | DHVQFN16 |
| 74HC157D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 92 | 9.2 | 51 | SO16 |
| 74HC157PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | 124 | 4.4 | 53.6 | TSSOP16 |
| 74HCT157BQ-Q100 | 4.5?-?5.5 | TTL | ± 4 | 13 | low | -40~125 | 92 | 13.1 | 61 | DHVQFN16 |
| 74HCT157D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 13 | low | -40~125 | 92 | 9.2 | 51 | SO16 |
| 74HCT157PW-Q100 | 4.5?-?5.5 | TTL | ± 4 | 13 | low | -40~125 | 124 | 4.4 | 53.6 | TSSOP16 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC157BQ-Q100 | 74HC157BQ‑Q100,115 (935298904115) |
Active | HC157 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HC157D-Q100 | 74HC157D‑Q100,118 (935298905118) |
Active | 74HC157D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC157PW-Q100 | 74HC157PW‑Q100,118 (935298906118) |
Active | HC157 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT157BQ-Q100 | 74HCT157BQ‑Q100,11 (935298907115) |
Active | HCT157 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HCT157D-Q100 | 74HCT157D‑Q100,118 (935298908118) |
Active | 74HCT157D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HCT157PW-Q100 | 74HCT157PW‑Q100,11 (935298909118) |
Active | HCT157 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC157BQ-Q100 | 74HC157BQ‑Q100,115 | 74HC157BQ-Q100 |
|
|
| 74HC157D-Q100 | 74HC157D‑Q100,118 | 74HC157D-Q100 |
|
|
| 74HC157PW-Q100 | 74HC157PW‑Q100,118 | 74HC157PW-Q100 |
|
|
| 74HCT157BQ-Q100 | 74HCT157BQ‑Q100,11 | 74HCT157BQ-Q100 |
|
|
| 74HCT157D-Q100 | 74HCT157D‑Q100,118 | 74HCT157D-Q100 |
|
|
| 74HCT157PW-Q100 | 74HCT157PW‑Q100,11 | 74HCT157PW-Q100 |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT157_Q100 | Quad 2-input multiplexer | Data sheet | 2024-05-28 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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