NXS0108
Dual supply translating transceiver; open drain; auto direction sensing
The NXS0108 is an 8-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 8-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.2 V and 3.6 V and VCC(B) can be supplied at any voltage between 1.65 V and 5.5 V, making the device suitable for translating between any of the voltage nodes (1.2 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range:
VCC(A): 1.2 V to 3.6 V and VCC(B): 1.65 V to 5.5 V
Maximum data rates:
Push-pull: 110 Mbps
IOFF circuitry provides partial Power-down mode operation
Inputs accept voltages up to 5.5 V
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port
HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V
- IEC61000-4-2 contact discharge exceeds 8000 V for B port
Latch-up performance exceeds 100 mA per JESD 78B Class II
Specified from -40 °C to +85 °C and -40 °C to +125 °C
Applications
Desktop PC
Handset
Smartphone
Tablet
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXS0108BQ | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.3 | 8 | low | -40~125 | 60 | 1 | 29 | DHVQFN20 | Bi-directional | AutoSense |
| NXS0108BQ-Q100 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.3 | 8 | low | -40~125 | 60 | 1 | 29 | DHVQFN20 | Bi-directional | AutoSense |
| NXS0108PW | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.3 | 8 | low | -40~125 | 93 | 2.5 | 36 | TSSOP20 | Bi-directional | AutoSense |
| NXS0108PW-Q100 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.3 | 8 | low | -40~125 | 93 | 2.5 | 36 | TSSOP20 | Bi-directional | AutoSense |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXS0108BQ | NXS0108BQX (935289743115) |
Active | NXS0108B |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| NXS0108BQ-Q100 | NXS0108BQ‑Q100X (935690991115) |
Active | NXS0108B |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| NXS0108PW | NXS0108PWJ (935289744118) |
Active | NXS0108 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| NXS0108PW-Q100 | NXS0108PW‑Q100J (935690989118) |
Active | NXS0108 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NXS0108BQ | NXS0108BQX | NXS0108BQ |
|
|
| NXS0108BQ-Q100 | NXS0108BQ‑Q100X | NXS0108BQ-Q100 |
|
|
| NXS0108PW | NXS0108PWJ | NXS0108PW |
|
|
| NXS0108PW-Q100 | NXS0108PW‑Q100J | NXS0108PW-Q100 |
|
|
文檔 (12)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| NXS0108 | Dual supply translating transceiver; open drain; auto?direction?sensing | Data sheet | 2024-07-31 |
| AN90014 | Pin FMEA for NXS family | Application note | 2020-03-25 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| nxs0108 | NXS0108 IBIS model | IBIS model | 2020-11-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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