NXS0104
Dual supply translating transceiver; open drain; auto direction sensing
The NXS0104 is a 4?-?bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 4?-?bit input?-?output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at any voltage between 2.3 V and 5.5 V, making the device suitable for translating between any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high?-?impedance OFF?-?state. This device is fully specified for partial power?-?down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range:
VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V
Maximum data rates:
Push-pull: 24 Mbps
IOFF circuitry provides partial Power-down mode operation
Inputs accept voltages up to 5.5 V
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port
HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
IEC61000-4-2 contact discharge exceeds 8000 V for B port
Latch-up performance exceeds 100 mA per JESD 78B Class II
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
Applications
Desktop PC
Handset
Smartphone
Tablet
參數(shù)類型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXS0104BQ | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 96 | 12.8 | 64 | DHVQFN14 | Bi-directional | AutoSense |
| NXS0104BQ-Q100 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 96 | 12.8 | 64 | DHVQFN14 | Bi-directional | AutoSense |
| NXS0104GU12 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 135 | 4.2 | 58 | XQFN12 | Bi-directional | AutoSense |
| NXS0104GU12-Q100 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 135 | 4.2 | 58 | XQFN12 | Bi-directional | AutoSense |
| NXS0104PW | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 133 | 4.9 | 58 | TSSOP14 | Bi-directional | AutoSense |
| NXS0104PW-Q100 | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 133 | 4.9 | 58 | TSSOP14 | Bi-directional | AutoSense |
| NXS0104UM | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 137 | 31 | WLCSP12 | Bi-directional | AutoSense |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXS0104BQ | NXS0104BQX (935690692115) |
Active | S0104 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| NXS0104BQ-Q100 | NXS0104BQ‑Q100X (935690811115) |
Active | S0104 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| NXS0104GU12 | NXS0104GU12X (935690693115) |
Active | m4 |
XQFN12 (SOT1174-1) |
SOT1174-1 | SOT1174-1_115 | |
| NXS0104GU12-Q100 | NXS0104GU12‑Q100X (935691322115) |
Active | m4 |
XQFN12 (SOT1174-1) |
SOT1174-1 | SOT1174-1_115 | |
| NXS0104PW | NXS0104PWJ (935690691118) |
Active | NXS0104 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| NXS0104PW-Q100 | NXS0104PW‑Q100J (935690809118) |
Active | NXS0104 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| NXS0104UM | NXS0104UMAZ (935691108336) |
Active | m4 |
WLCSP12 (SOT8019-1) |
SOT8019-1 | SOT8019-1_336 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXS0104UM | NXS0104UMZ (935691108084) |
Withdrawn / End-of-life | m4 |
WLCSP12 (SOT8019-1) |
SOT8019-1 | 暫無信息 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NXS0104BQ | NXS0104BQX | NXS0104BQ |
|
|
| NXS0104BQ-Q100 | NXS0104BQ‑Q100X | NXS0104BQ-Q100 |
|
|
| NXS0104GU12 | NXS0104GU12X | NXS0104GU12 |
|
|
| NXS0104GU12-Q100 | NXS0104GU12‑Q100X | NXS0104GU12-Q100 |
|
|
| NXS0104PW | NXS0104PWJ | NXS0104PW |
|
|
| NXS0104PW-Q100 | NXS0104PW‑Q100J | NXS0104PW-Q100 |
|
|
| NXS0104UM | NXS0104UMAZ | NXS0104UM |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NXS0104UM | NXS0104UMZ | NXS0104UM |
|
|
文檔 (17)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| NXS0104 | Dual supply translating transceiver; open drain; auto?direction?sensing | Data sheet | 2024-04-04 |
| AN90014 | Pin FMEA for NXS family | Application note | 2020-03-25 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| SOT8019-1 | 3D model for products with SOT8019-1 package | Design support | 2023-02-07 |
| nxs0104 | NXS0104 IBIS model | IBIS model | 2020-11-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2024-04-11 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SOT8019-1 | wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm | Package information | 2022-02-11 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| SOT8019-1 | 3D model for products with SOT8019-1 package | Design support | 2023-02-07 |
| nxs0104 | NXS0104 IBIS model | IBIS model | 2020-11-05 |
Ordering, pricing & availability
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