NXT4557
SIM card interface level translator with enable pin
The NXT4557 device is built for interfacing a SIM card with a single low-voltage host side interface. The NXT4557 has three level translators to convert the data, RST and CLK signals between a SIM card and a host microcontroller. A high speed level translation capable of supporting class?-?B, class?-?C SIM cards. An active HIGH EN pin enables normal operation of the translator. A HIGH to LOW transition on pin EN initiates a shutdown sequence on SIM card pins in accordance with ISO-7816-3.
The NXT4557 is compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart card interface requirements.
Features and benefits
Support SIM cards and eSIM with supply voltages 1.62 V to 3.3 V
Host micro-controller operating voltage range: 1.08 V to 1.98 V
Automatic level translation of I/O, RST and CLK between SIM card and host side interface with capacitance isolation
Incorporates shutdown feature for the SIM card signals according to ISO-7816-3
High Vdis(UVLO_AC) switching level, arranging quick shut down when VCC_SIM powers down
Integrated pull-up resistors; no external resistor required
Integrated EMI Filters suppresses higher harmonics of digital I/O's
A HIGH EN signal enables the translation of the signals
Low current shutdown mode < 1 μA
Supports clock speed beyond 5 MHz clock
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
IEC61000-4-2 level 4, contact and air discharge on all SIM card-side pins are 8000 V and 15000 V
Available in 10-pin XQFN package
Specified from -40 °C to +85 °C
Applications
NXT4557 can be used with a range of SIM card attached devices including:
Mobile and personal phones
Wireless modems
SIM card terminals
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXT4557GU | 1.08?-?1.98 | 1.62?-?3.3 | CMOS | ± 1 | 20 | 3 | low | -40~85 | 118 | 5.1 | 144 | XQFN10 | Application specific |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXT4557GU | NXT4557GUX (935691191115) |
Active | z7 |
XQFN10 (SOT1160-1) |
SOT1160-1 | SOT1160-1_115 |
文檔 (8)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| NXT4557 | SIM card interface level translator with enable pin | Data sheet | 2024-07-31 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT1160-1 | 3D model for products with SOT1160-1 package | Design support | 2019-10-03 |
| nxt4557 | NXT4557 IBIS model | IBIS model | 2021-08-31 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| XQFN10_SOT1160-1_mk | plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT1160-1 | plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-07 |
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