CBTD3384-Q100
10-bit level shifting bus switch with 5-bit output enables
The CBTD3384-Q100 is a dual 5-pole, single-throw bus switch. The device features two output enable inputs (nOE) that each control five switch channels. The switches are disabled when the associated nOE input is HIGH. CBTD3384-Q100 is specifically designed for 5 V to 3.3 V level shifting applications. This device is fully specified for partial power down applications using IOFF.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 3) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 3)
Specified from -40 °C to +85 °C
Designed to be used in 5 V to 3.3 V level shifting applications with internal diode
5 ? switch connection between two ports
Direct interface with TTL levels
IOFF circuitry provides partial Power-down mode operation
Latch-up protection exceeds 100 mA per JESD78
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
參數(shù)類型
| 型號 | VCC (V) | RON (Ω) | Logic switching levels | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| CBTD3384PW-Q100 | 4.5?-?5.5 | 7 | TTL | 0.25 | very low | -40~85 | 84 | 2.7 | 39 | TSSOP24 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBTD3384PW-Q100 | CBTD3384PW‑Q100J (935691612118) |
Active | CBTD3384 |
TSSOP24 (SOT355-1) |
SOT355-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT355-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBTD3384PW-Q100 | CBTD3384PW‑Q100J | CBTD3384PW-Q100 |
|
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文檔 (6)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| CBTD3384_Q100 | 10-bit level shifting bus switch with 5-bit output enables | Data sheet | 2024-06-04 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
Ordering, pricing & availability
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