74HC259-Q100; 74HCT259-Q100
8-bit addressable latch
The 74HC259-Q100; 74HCT259-Q100 is an 8-bit addressable latch. The device features four modes of operation. In the addressable latch mode, data on the D input is written into the latch addressed by the inputs A0 to A3. The addressed latch will follow the data input, non-addressed latches will retain their previous states. In memory mode, all latches retain their previous states and are unaffected by the data or address inputs. In the 3-to-8 decoding or demultiplexing mode, the addressed output follows the D input and all other outputs are LOW. In the reset mode, all outputs are forced LOW and unaffected by the data or address inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
Combined demultiplexer and 8-bit latch
Serial-to-parallel capability
Output from each storage bit available
Random (addressable) data entry
Easily expandable
Common reset input
Useful as a 3-to-8 active HIGH decoder
Input levels:
For 74HC259-Q100: CMOS level
For 74HCT259-Q100: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC259BQ-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 18 | 8 | low | -40~125 | 89 | 10.8 | 57 | DHVQFN16 |
| 74HC259D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 18 | 8 | low | -40~125 | 88 | 7.7 | 47 | SO16 |
| 74HC259PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 18 | 8 | low | -40~125 | 121 | 3.6 | 49.9 | TSSOP16 |
| 74HCT259BQ-Q100 | 4.5?-?5.5 | TTL | ± 4 | 20 | 8 | low | -40~125 | 89 | 10.8 | 57 | DHVQFN16 |
| 74HCT259D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 20 | 8 | low | -40~125 | 88 | 7.7 | 47 | SO16 |
| 74HCT259PW-Q100 | 4.5?-?5.5 | TTL | ± 4 | 20 | 8 | low | -40~125 | 121 | 3.6 | 49.9 | TSSOP16 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC259BQ-Q100 | 74HC259BQ‑Q100,115 (935298821115) |
Active | HC259 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HC259D-Q100 | 74HC259D‑Q100,118 (935298822118) |
Active | 74HC259D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC259PW-Q100 | 74HC259PW‑Q100,118 (935298823118) |
Active | HC259 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT259BQ-Q100 | 74HCT259BQ‑Q100,11 (935298824115) |
Active | HCT259 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HCT259D-Q100 | 74HCT259D‑Q100,118 (935298825118) |
Active | 74HCT259D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HCT259PW-Q100 | 74HCT259PW‑Q100,11 (935298826118) |
Active | HCT259 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC259BQ-Q100 | 74HC259BQ‑Q100,115 | 74HC259BQ-Q100 |
|
|
| 74HC259D-Q100 | 74HC259D‑Q100,118 | 74HC259D-Q100 |
|
|
| 74HC259PW-Q100 | 74HC259PW‑Q100,118 | 74HC259PW-Q100 |
|
|
| 74HCT259BQ-Q100 | 74HCT259BQ‑Q100,11 | 74HCT259BQ-Q100 |
|
|
| 74HCT259D-Q100 | 74HCT259D‑Q100,118 | 74HCT259D-Q100 |
|
|
| 74HCT259PW-Q100 | 74HCT259PW‑Q100,11 | 74HCT259PW-Q100 |
|
|
文檔 (20)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT259_Q100 | 8-bit addressable latch | Data sheet | 2024-03-11 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| hc259 | 74HC259 IBIS model | IBIS model | 2022-10-21 |
| hct259 | 74HCT259 IBIS model | IBIS model | 2022-10-21 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| hc259 | 74HC259 IBIS model | IBIS model | 2022-10-21 |
| hct259 | 74HCT259 IBIS model | IBIS model | 2022-10-21 |
Ordering, pricing & availability
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