74LVC541A-Q100
Octal buffer/line driver with 5 V tolerant inputs/outputs; 3-state
The 74LVC541A?-?Q100 is an 8?-?bit buffer/line driver with 3?-?state outputs. The device features two output enables (OE1 and OE2). A HIGH on OEn causes the associated outputs to assume a high?-?impedance OFF?-?state . Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
Schmitt?-?trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Overvoltage tolerant inputs to 5.5 V
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power consumption
Direct interface with TTL levels
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC541ABQ-Q100 | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | 79 | 9.6 | 50 | DHVQFN20 |
| 74LVC541AD-Q100 | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | 85 | 27.7 | 61 | SO20 |
| 74LVC541APW-Q100 | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | 101 | 4.7 | 45 | TSSOP20 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC541ABQ-Q100 | 74LVC541ABQ‑Q100X (935300233115) |
Active | LVC541A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74LVC541AD-Q100 | 74LVC541AD‑Q100J (935300234118) |
Active | 74LVC541AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74LVC541APW-Q100 | 74LVC541APW‑Q100J (935300235118) |
Active | LVC541A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC541ABQ-Q100 | 74LVC541ABQ‑Q100X | 74LVC541ABQ-Q100 |
|
|
| 74LVC541AD-Q100 | 74LVC541AD‑Q100J | 74LVC541AD-Q100 |
|
|
| 74LVC541APW-Q100 | 74LVC541APW‑Q100J | 74LVC541APW-Q100 |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC541A_Q100 | Octal buffer/line driver with 5 V tolerant inputs/outputs; 3?-?state | Data sheet | 2023-09-07 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvc541a | lvc541a IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvc541a | lvc541a IBIS model | IBIS model | 2013-04-09 |
Ordering, pricing & availability
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