74AHC04-Q100; 74AHCT04-Q100
Hex inverter
The 74AHC04-Q100; 74AHCT04-Q100 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.
The 74AHC04-Q100; 74AHCT04-Q100 provides six inverting buffers.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Balanced propagation delays
Inputs accept voltages higher than VCC
Input levels:
For 74AHC04-Q100: CMOS level
For 74AHCT04-Q100: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC04BQ-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | 106 | 20.9 | 74 | DHVQFN14 |
| 74AHC04D-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | 108 | 20.1 | 66 | SO14 |
| 74AHC04PW-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | 141 | 7.79 | 67.1874314159292 | TSSOP14 |
| 74AHCT04BQ-Q100 | 4.5?-?5.5 | TTL | ± 8 | 60 | 6 | low | -40~125 | 106 | 20.9 | 74 | DHVQFN14 |
| 74AHCT04D-Q100 | 4.5?-?5.5 | TTL | ± 8 | 60 | 6 | low | -40~125 | 108 | 20.1 | 66 | SO14 |
| 74AHCT04PW-Q100 | 4.5?-?5.5 | TTL | ± 8 | 60 | 6 | low | -40~125 | 141 | 1 | 67.1874314159292 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC04BQ-Q100 | 74AHC04BQ‑Q100X (935301369115) |
Active | AHC04 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHC04D-Q100 | 74AHC04D‑Q100J (935301014118) |
Active | 74AHC04D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHC04PW-Q100 | 74AHC04PW‑Q100J (935301013118) |
Active | AHC04 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74AHCT04BQ-Q100 | 74AHCT04BQ‑Q100X (935301378115) |
Active | AHT04 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHCT04D-Q100 | 74AHCT04D‑Q100J (935301015118) |
Active | 74AHCT04D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHCT04PW-Q100 | 74AHCT04PW‑Q100J (935301016118) |
Active | AHCT04 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC04BQ-Q100 | 74AHC04BQ‑Q100X | 74AHC04BQ-Q100 |
|
|
| 74AHC04D-Q100 | 74AHC04D‑Q100J | 74AHC04D-Q100 |
|
|
| 74AHC04PW-Q100 | 74AHC04PW‑Q100J | 74AHC04PW-Q100 |
|
|
| 74AHCT04BQ-Q100 | 74AHCT04BQ‑Q100X | 74AHCT04BQ-Q100 |
|
|
| 74AHCT04D-Q100 | 74AHCT04D‑Q100J | 74AHCT04D-Q100 |
|
|
| 74AHCT04PW-Q100 | 74AHCT04PW‑Q100J | 74AHCT04PW-Q100 |
|
|
文檔 (18)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT04_Q100 | Hex inverter | Data sheet | 2024-02-05 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc04 | ahc04 IBIS model | IBIS model | 2013-04-08 |
| ahct04 | ahct04 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc04 | ahc04 IBIS model | IBIS model | 2013-04-08 |
| ahct04 | ahct04 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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