74LVC132A-Q100
Quad 2-input NAND Schmitt trigger
The 74LVC132A-Q100 provides four 2-input NAND gates with Schmitt trigger inputs. It can transform slowly changing input signals into sharply defined, jitter-free output signals.
The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environment.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.2 V to 3.6 V
5 V tolerant inputs for interfacing with 5 V logic
CMOS low-power consumption
Direct interface with TTL levels
Unlimited input rise and fall times
Inputs accept voltages up to 5.5 V
Complies with JEDEC standard JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Applications
Wave and pulse shapers for highly noisy environments
Astable multivibrator
Monostable multivibrator.
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC132ABQ-Q100 | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 3.4 | 175 | 4 | low | -40~125 | 108 | 22.6 | 76 | DHVQFN14 |
| 74LVC132AD-Q100 | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 3.4 | 175 | 4 | low | -40~125 | 111 | 21.9 | 69 | SO14 |
| 74LVC132APW-Q100 | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 3.4 | 175 | 4 | low | -40~125 | 143 | 8.4 | 69 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC132ABQ-Q100 | 74LVC132ABQ‑Q100X (935301108115) |
Active | C132A |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74LVC132AD-Q100 | 74LVC132AD‑Q100J (935301106118) |
Active | 74LVC132AD |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74LVC132APW-Q100 | 74LVC132APW‑Q100J (935301107118) |
Active | LVC132A |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC132ABQ-Q100 | 74LVC132ABQ‑Q100X | 74LVC132ABQ-Q100 |
|
|
| 74LVC132AD-Q100 | 74LVC132AD‑Q100J | 74LVC132AD-Q100 |
|
|
| 74LVC132APW-Q100 | 74LVC132APW‑Q100J | 74LVC132APW-Q100 |
|
|
文檔 (17)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC132A_Q100 | Quad 2-input NAND Schmitt trigger | Data sheet | 2024-02-12 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lvc132a | lvc132a IBIS model | IBIS model | 2018-11-28 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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