74HC175-Q100; 74HCT175-Q100
Quad D-type flip-flop with reset; positive-edge trigger
The 74HC175-Q100; 74HCT175-Q100 are quad positive edge-triggered D-type flip-flops with individual data inputs (Dn) and both Qn and Qn outputs. The common clock (CP) and master reset (MR) inputs load and reset all flip-flops simultaneously. The D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition is stored in the flip-flop and appears at the Q output. A LOW on MR causes the flip-flops and outputs to be reset LOW.
The device is useful for applications where both the true and complement outputs are required and the clock and master reset are common to all storage elements.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Input levels:
For 74HC175-Q100: CMOS level
For 74HCT175-Q100: TTL level
Four edge-triggered D-type flip-flops
Asynchronous master reset
Complies with JEDEC standard no. 7A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
參數(shù)類(lèi)型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC175D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 17 | 83 | low | -40~125 | 79 | 3.6 | 37 | SO16 |
| 74HC175PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 17 | 83 | low | -40~125 | 113 | 1.8 | 41 | TSSOP16 |
| 74HCT175D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 16 | 54 | low | -40~125 | 79 | 3.6 | 37 | SO16 |
| 74HCT175PW-Q100 | 4.5?-?5.5 | TTL | ± 4 | 16 | 54 | low | -40~125 | 113 | 1.8 | 41 | TSSOP16 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC175D-Q100 | 74HC175D‑Q100J (935300783118) |
Active | 74HC175D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC175PW-Q100 | 74HC175PW‑Q100J (935300784118) |
Active | HC175 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT175D-Q100 | 74HCT175D‑Q100J (935300785118) |
Active | 74HCT175D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HCT175PW-Q100 | 74HCT175PW‑Q100J (935300786118) |
Active | HCT175 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC175D-Q100 | 74HC175D‑Q100J | 74HC175D-Q100 |
|
|
| 74HC175PW-Q100 | 74HC175PW‑Q100J | 74HC175PW-Q100 |
|
|
| 74HCT175D-Q100 | 74HCT175D‑Q100J | 74HCT175D-Q100 |
|
|
| 74HCT175PW-Q100 | 74HCT175PW‑Q100J | 74HCT175PW-Q100 |
|
|
文檔 (15)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74HC_HCT175_Q100 | Quad D-type flip-flop with reset; positive-edge trigger | Data sheet | 2024-03-14 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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