外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8027-1 | WLCSP9 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | 2021-06-16 |
Boards
| Part number | Description | Type | Quick links | Shop link |
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描述 NEVB-LOGIC03 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
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類型 Evaluation board
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Quick links
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Shop link
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相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8027-1 | 3D model for products with SOT8027-1 package | Design support | 2023-02-07 |
| SOT8027-1 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | Package information | 2022-09-27 |
| SOT8027-1_336 | WLCSP9; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-03-03 |