可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經銷商處購買 |
|---|---|---|---|---|
| BUK7K5R6-30E | BUK7K5R6-30E,115 | 934066992115 | SOT1205 | 訂單產品 |
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Click here for more informationBUK7K5R6-30E
Dual N-channel 30 V, 5.1 mOhm standard level MOSFET
Dual standard level N-channel MOSFET in an LFPAK56D (Dual Power-SO8) package using TrenchMOS technology. This product has been designed and qualified to AEC Q101 standard for use in high performance automotive applications.
Features and benefits
Dual MOSFET
Q101 compliant
Repetitive avalanche rated
Suitable for thermally demanding environments due to 175 °C rating
True standard level gate with VGS(th) of greater than 1 V at 175 °C
Applications
12 V Automotive systems
Motors, lamps and solenoid control
Transmission control
Ultra high performance power switching
參數類型
| 型號 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BUK7K5R6‑30E | SOT1205 | LFPAK56D; Dual LFPAK | Production | N | 2 | 30 | 5.6 | 175 | 40 | 9.5 | 29.7 | 64 | 20.7 | 3 | Y | 1477 | 380 | 2012-07-23 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BUK7K5R6‑30E | BUK7K5R6‑30E,115 (934066992115) |
Active | 75E630 |
LFPAK56D; Dual LFPAK (SOT1205) |
SOT1205 |
WAVE_BG-BD-1
|
SOT1205_115 |
Series
文檔 (24)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| BUK7K5R6-30E | Dual N-channel 30 V, 5.6 mΩ standard level MOSFET | Data sheet | 2018-04-04 |
| AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2025-09-10 |
| AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
| AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
| AN11156 | Using Power MOSFET Zth Curves | Application note | 2025-10-21 |
| AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2025-10-21 |
| AN11158_ZH | Understanding power MOSFET data sheet parameters | Application note | 2021-01-04 |
| AN11160 | Designing RC Snubbers | Application note | 2025-09-10 |
| AN11243 | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2025-09-08 |
| AN11261 | RC Thermal Models | Application note | 2025-09-10 |
| AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
| AN90003 | LFPAK MOSFET thermal design guide | Application note | 2025-09-30 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT1205 | 3D model for products with SOT1205 package | Design support | 2017-06-30 |
| nexperia_document_leaflet_LFPAK56D_factsheet_LR_201708 | LFPAK56D the ultimate dual MOSFET | Leaflet | 2017-08-17 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| LFPAK56D_SOT1205_mk | plastic, single ended surface mounted package (LFPAK56D); 8 leads; 1.27 mm pitch; 4.7 mm x 5.3 mm x 1.05 mm body | Marcom graphics | 2017-01-28 |
| SOT1205 | plastic, single ended surface mounted package (LFPAK56D); 8 leads | Package information | 2022-03-11 |
| SOT1205_115 | LFPAK56D; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2021-01-11 |
| BUK7K5R6-30E | BUK7K5R6-30E Spice model | SPICE model | 2012-09-12 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2025-09-10 |
| BUK7K5R6-30E_RC_Thermal_Model | BUK7K5R6-30E Thermal design model | Thermal design | 2021-01-18 |
| BUK7K5R6-30E | BUK7K5R6-30E Thermal model | Thermal model | 2012-09-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| BUK7K5R6-30E | BUK7K5R6-30E Spice model | SPICE model | 2012-09-12 |
| BUK7K5R6-30E_RC_Thermal_Model | BUK7K5R6-30E Thermal design model | Thermal design | 2021-01-18 |
| BUK7K5R6-30E | BUK7K5R6-30E Thermal model | Thermal model | 2012-09-03 |
| SOT1205 | 3D model for products with SOT1205 package | Design support | 2017-06-30 |
訂購、定價與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| BUK7K5R6‑30E | BUK7K5R6‑30E,115 | 934066992115 | Active | SOT1205_115 | 1,500 |
|
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網絡可為您提供 Nexperia 樣品支持。查看官方經銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.