可訂購部件
| 型號(hào) | 可訂購的器件編號(hào) | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
|---|---|---|---|---|
| PMEG2010EXD | PMEG2010EXDX | 934666103115 | SOD323HP | 訂單產(chǎn)品 |
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationPMEG2010EXD
20 V, 1 A low VF Schottky barrier rectifier
Planar Schottky barrier rectifier encapsulated in a CFP2-HP (SOD323HP) power flat lead Surface-Mounted Device (SMD) plastic package.
Features and benefits
Low forward voltage
High power capability due to clip-bond package
Power flat lead plastic package with exposed heatsink for optimal thermal connection
Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Freewheeling
Reverse polarity protection
OR-ing
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (A) | Nr of functions | Configuration | VF [max] (mV) | IR [max] @25 C (μA) | Cd [max] (pF) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2010EXD | SOD323HP | CFP2-HP | 1.3 x 2.2 x 0.68 | 20 | 1 | single | single | 500 | 50 | 37 | N |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PMEG2010EXD | PMEG2010EXDX (934666103115) |
Active | 8J |
CFP2-HP (SOD323HP) |
SOD323HP |
REFLOW_BG-BD-1
|
SOD323HP_115 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PMEG2010EXD | PMEG2010EXDX | PMEG2010EXD |
|
|
Series
文檔 (8)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PMEG2010EXD | 20 V, 1 A Schottky barrier rectifier | Data sheet | 2025-01-23 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOD323HP | 3D model for products with SOD323HP package | Design support | 2022-02-14 |
| SOD323HP | SOD323HP: plastic surface-mounted package with solderable lead ends; 2.2 mm x 1.3 mm x 0.68 mm body | Package information | 2023-08-02 |
| SOD323HP_115 | Reel pack for SMD, 7"; Q1/T1-Q2/T3 product orientation | Packing information | 2021-09-07 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PMEG2010EXD | PMEG2010EXD SPICE model | SPICE model | 2025-10-11 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PMEG2010EXD | PMEG2010EXD SPICE model | SPICE model | 2025-10-11 |
| SOD323HP | 3D model for products with SOD323HP package | Design support | 2022-02-14 |
訂購、定價(jià)與供貨
| 型號(hào) | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| PMEG2010EXD | PMEG2010EXDX | 934666103115 | Active | SOD323HP_115 | 4,500 |
|
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機(jī)構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.