可訂購(gòu)部件
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 訂購(gòu)代碼(12NC) | 封裝 | 從經(jīng)銷(xiāo)商處購(gòu)買(mǎi) |
|---|---|---|---|---|
| PSMNR60-25YLH | PSMNR60-25YLHX | 934660104115 | SOT669 | 訂單產(chǎn)品 |
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Click here for more informationN-channel 25 V, 0.7 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 technology
Logic level gate drive N-channel enhancement mode MOSFET in LFPAK56 package optimized for low RDSon. Low IDSS leakage even when hot, high efficiency and high current. Rated to 300 A, optimized for DC load switch and hot-swap applications.
100% avalanche tested at I(AS) = 190 A
Optimized for low RDSon
Low leakage < 1 μA at 25 °C
Low spiking and ringing for low EMI designs
Optimized for 4.5 V gate drive
Copper-clip for low parasitic inductance and resistance
High reliability LFPAK package, qualified to 175 °C
Wave solderable; exposed leads for optimal solder coverage and visual solder inspection
Hot swap
e-Fuse
Power OR-ing
DC switch / Load switch
Battery protection
Brushed and BLDC (brushless) motor control
Synchronous rectification in AC-DC and DC-DC applications
| 型號(hào) | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMNR60‑25YLH | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 25 | 0.7 | 1.02 | 175 | 300 | 15 | 43 | 89 | 268 | 41 | 1.64 | N | 5411 | 3412 | 2018-02-22 |
| 型號(hào) | 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PSMNR60‑25YLH | PSMNR60‑25YLHX (934660104115) |
Active | H6025L |
LFPAK56; Power‑SO8 (SOT669) |
SOT669 |
WAVE_BG-BD-1
|
SOT669_115 |
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PSMNR60‑25YLH | PSMNR60‑25YLHX | PSMNR60-25YLH |
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| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| PSMNR60-25YLH | N-channel 25 V, 0.7 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 technology | Data sheet | 2019-10-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| LFPAK56_POWER-SO8_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT669 | plastic, single-ended surface-mounted package; 4 terminals | Package information | 2025-03-20 |
| SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
| Reliability_information_t11_sot669 | Reliability qualification information | Quality document | 2022-08-19 |
| T11_SOT669_PSMNR60-25YLH_Nexperia_Quality_document | Product Quality Quick Reference Information | Quality document | 2022-08-19 |
| PSMNR60-25YLH | PSMNR60-25YLH SPICE model | SPICE model | 2019-11-04 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2025-09-10 |
| CauerModel_PSMNR60-25YLH | PSMNR60-25YLH Cauer model | Thermal model | 2019-11-04 |
| FosterModel_PSMNR60-25YLH | PSMNR60-25YLH Foster model | Thermal model | 2019-11-04 |
| PSMNR60-25YLH | PSMNR60-25YLH Thermal model | Thermal model | 2019-11-04 |
| PSMNR60-25YLH | PSMNR60-25YLH FloTherm model | Thermal model | 2019-11-04 |
| PSMNR60-25YLH_Cauer | PSMNR60-25YLH Cauer model | Thermal model | 2019-11-04 |
| PSMNR60-25YLH_Foster | PSMNR60-25YLH Foster model | Thermal model | 2019-11-04 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| PSMNR60-25YLH | PSMNR60-25YLH SPICE model | SPICE model | 2019-11-04 |
| CauerModel_PSMNR60-25YLH | PSMNR60-25YLH Cauer model | Thermal model | 2019-11-04 |
| FosterModel_PSMNR60-25YLH | PSMNR60-25YLH Foster model | Thermal model | 2019-11-04 |
| PSMNR60-25YLH | PSMNR60-25YLH Thermal model | Thermal model | 2019-11-04 |
| PSMNR60-25YLH | PSMNR60-25YLH FloTherm model | Thermal model | 2019-11-04 |
| PSMNR60-25YLH_Cauer | PSMNR60-25YLH Cauer model | Thermal model | 2019-11-04 |
| PSMNR60-25YLH_Foster | PSMNR60-25YLH Foster model | Thermal model | 2019-11-04 |
| SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
| 型號(hào) | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購(gòu)買(mǎi) |
|---|---|---|---|---|---|---|
| PSMNR60‑25YLH | PSMNR60‑25YLHX | 934660104115 | Active | SOT669_115 | 1,500 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.