CBT3125
Quadruple FET bus switch
The CBT3125 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output enable (nOE) input is HIGH.
Features and benefits
Standard ’125’-type pinout
5 Ω switch connection between two ports
TTL-compatible input levels
Latch-up performance exceeds 500 mA per JESD78
ESD protection:
HBM JESD22-A114 exceeds 2000 V
MM JESD22-A115 exceeds 200 V
CDM JESD22-C101 exceeds 1000 V
參數(shù)類型
| 型號 |
|---|
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBT3125D | CBT3125D,112 (935270672112) |
Obsolete | CBT3125D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_112 |
| CBT3125D,118 (935270672118) |
Obsolete | CBT3125D | SOT108-1_118 | ||||
| CBT3125DB | CBT3125DB,112 (935270671112) |
Obsolete | CT3125 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| CBT3125DB,118 (935270671118) |
Obsolete | CT3125 | SOT337-1_118 | ||||
| CBT3125DS | CBT3125DS,112 (935270673112) |
Obsolete | CBT3125 Standard Procedure Standard Procedure |
SSOP16 (SOT519-1) |
SOT519-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| CBT3125DS,118 (935270673118) |
Obsolete | CBT3125 Standard Procedure Standard Procedure | SOT519-1_118 | ||||
| CBT3125PW | CBT3125PW/G,118 (935277135118) |
Obsolete | 3125/G Standard Procedure Standard Procedure |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| CBT3125PW,112 (935270670112) |
Obsolete | CBT3125 | 暫無信息 | ||||
| CBT3125PW,118 (935270670118) |
Obsolete | CBT3125 | SOT402-1_118 |
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBT3125D | CBT3125D,112 | CBT3125D |
|
|
| CBT3125D | CBT3125D,118 | CBT3125D |
|
|
| CBT3125DB | CBT3125DB,112 | CBT3125DB |
|
|
| CBT3125DB | CBT3125DB,118 | CBT3125DB |
|
|
| CBT3125DS | CBT3125DS,112 | CBT3125DS |
|
|
| CBT3125DS | CBT3125DS,118 | CBT3125DS |
|
|
| CBT3125PW | CBT3125PW/G,118 | CBT3125PW |
|
|
| CBT3125PW | CBT3125PW,112 | CBT3125PW |
|
|
| CBT3125PW | CBT3125PW,118 | CBT3125PW |
|
|
文檔 (20)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| CBT3125 | Quadruple FET bus switch | Data sheet | 2018-10-01 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| cbt3125 | cbt3125 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| cbt3125 | cbt3125 IBIS model | IBIS model | 2013-04-08 |
樣品
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