74AHC157-Q100; 74AHCT157-Q100
Quad 2-input multiplexer
The 74AHC/AHCT157-Q100 are high-speed Si-gate CMOS devices and are pin compatible with Low Power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A.
The 74AHC/AHCT157-Q100 are quad 2-input multiplexer which select 4 bits of data from two sources under the control of a common data select input (S). The enable input (E) is active LOW. When E is HIGH, all of the outputs (1Y to 4Y) are forced LOW regardless of all other input conditions.
Moving the data from two groups of registers to four common output buses is a common use of the 74AHC/AHCT157-Q100. The state of the common data select input (S) determines the particular register from which the data comes. It can also be used as function generator. The device is useful for implementing highly irregular logic by generating any four of the 16 different functions of two variables with one variable common. The 74AHC/AHCT157-Q100 is logic implementation of a 4?-?pole, 2?-?position switch, where the position of the switch is determine by the logic levels applied to S.
The logic equations are:
1Y = E × (1I1 × S + 1I0 × S)
2Y = E × (2I1 × S + 2I0 × S)
3Y = E × (3I1 × S + 3I0 × S)
4Y = E × (4I1 × S + 4I0 × S)
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than VCC
Multiple input enable for easy expansion
Ideal for memory chip select decoding
For 74AHC157-Q100 only: operates with CMOS input levels
For 74AHCT157-Q100 only: operates with TTL input levels
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC157BQ-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 3.2 | low | -40~125 | 91 | 12.7 | 60 | DHVQFN16 |
| 74AHC157D-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 3.2 | low | -40~125 | 91 | 8.9 | 50 | SO16 |
| 74AHC157PW-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 3.2 | low | -40~125 | 123 | 4.2 | 53 | TSSOP16 |
| 74AHCT157BQ-Q100 | 4.5?-?5.5 | TTL | ± 8 | 3.2 | low | -40~125 | 91 | 12.7 | 60 | DHVQFN16 |
| 74AHCT157D-Q100 | 4.5?-?5.5 | TTL | ± 8 | 3.2 | low | -40~125 | 91 | 8.9 | 50 | SO16 |
| 74AHCT157PW-Q100 | 4.5?-?5.5 | TTL | ± 8 | 3.2 | low | -40~125 | 123 | 4.2 | 53 | TSSOP16 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC157BQ-Q100 | 74AHC157BQ‑Q100X (935300685115) |
Active | AHC157 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74AHC157D-Q100 | 74AHC157D‑Q100J (935300683118) |
Active | 74AHC157D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74AHC157PW-Q100 | 74AHC157PW‑Q100J (935300684118) |
Active | AHC157 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74AHCT157BQ-Q100 | 74AHCT157BQ‑Q100X (935300688115) |
Active | AHT157 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74AHCT157D-Q100 | 74AHCT157D‑Q100J (935300686118) |
Active | 74AHCT157D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74AHCT157PW-Q100 | 74AHCT157PW‑Q100J (935300687118) |
Active | AHCT157 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC157BQ-Q100 | 74AHC157BQ‑Q100X | 74AHC157BQ-Q100 |
|
|
| 74AHC157D-Q100 | 74AHC157D‑Q100J | 74AHC157D-Q100 |
|
|
| 74AHC157PW-Q100 | 74AHC157PW‑Q100J | 74AHC157PW-Q100 |
|
|
| 74AHCT157BQ-Q100 | 74AHCT157BQ‑Q100X | 74AHCT157BQ-Q100 |
|
|
| 74AHCT157D-Q100 | 74AHCT157D‑Q100J | 74AHCT157D-Q100 |
|
|
| 74AHCT157PW-Q100 | 74AHCT157PW‑Q100J | 74AHCT157PW-Q100 |
|
|
文檔 (18)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT157_Q100 | Quad 2-input multiplexer | Data sheet | 2024-03-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| ahc157 | ahc157 IBIS model | IBIS model | 2013-04-08 |
| ahct157 | ahct157 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| ahc157 | ahc157 IBIS model | IBIS model | 2013-04-08 |
| ahct157 | ahct157 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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