可訂購(gòu)部件
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 訂購(gòu)代碼(12NC) | 封裝 | 從經(jīng)銷商處購(gòu)買 |
|---|---|---|---|---|
| BC807-40QCH-Q | BC807-40QCH-QZ | 934664304147 | SOT8009 | 訂單產(chǎn)品 |
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Click here for more informationBC807-40QCH-Q
45 V, 500 mA PNP general-purpose transistors
PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
Type number | Package | NPN complement | ||
|---|---|---|---|---|
Name | JEDEC | Version | ||
BC807-16QCH-Q | DFN1412D-3 | MO-340CA | SOT8009 | BC817-16QCH-Q |
BC807-25QCH-Q | BC817-25QCH-Q | |||
BC807-40QCH-Q | BC817-40QCH-Q | |||
Features and benefits
High power dissipation capability
High current
Three current gain selections
Suitable for Automatic Optical Inspection (AOI) of solder joint
Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
High-temperature applications up to 175 °C
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
General-purpose switching and amplification
Space restricted applications
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | TJ [max] (°C) |
|---|---|---|---|---|
| BC807‑40QCH‑Q | SOT8009 | DFN1412D-3 | 1.4 x 1.2 x 0.48 | 175 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC807‑40QCH‑Q | BC807‑40QCH‑QZ (934664304147) |
Active | 8U |
DFN1412D‑3 (SOT8009) |
SOT8009 | SOT8009_147 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BC807‑40QCH‑Q | BC807‑40QCH‑QZ | BC807-40QCH-Q |
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文檔 (11)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BC807QCH-Q_SER | 45 V, 500 mA PNP general-purpose transistors | Data sheet | 2022-01-25 |
| AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
| AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧輕便的汽車 二極管和晶體管 | Brochure | 2022-04-26 |
| SOT8009 | 3D model for products with SOT8009 package | Design support | 2023-02-02 |
| Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
| SOT8009 | plastic, leadless ultra small outline package with side-wettable flanks (SWF);3 terminals; 0.8 mm pitch; 1.4 mm x 1.2 mm x 0.48 mm body | Package information | 2020-12-14 |
| SOT8009_147 | DFN1412D-3; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2021-02-08 |
| BC807-40QCH-Q_Nexperia_Product_Reliability | BC807-40QCH-Q Nexperia Product Reliability | Quality document | 2025-05-28 |
| BC807-40QCH-Q | BC807-40QCH-Q SPICE model | SPICE model | 2025-07-09 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BC807-40QCH-Q | BC807-40QCH-Q SPICE model | SPICE model | 2025-07-09 |
| SOT8009 | 3D model for products with SOT8009 package | Design support | 2023-02-02 |
訂購(gòu)、定價(jià)與供貨
| 型號(hào) | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購(gòu)買 |
|---|---|---|---|---|---|---|
| BC807‑40QCH‑Q | BC807‑40QCH‑QZ | 934664304147 | Active | SOT8009_147 | 5,000 |
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樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機(jī)構(gòu)訂購(gòu)樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.