可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
|---|---|---|---|---|
| BCP55-16T | BCP55-16TF | 934661088135 | SOT223 | 訂單產(chǎn)品 |
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationBCP55-16T
60 V, 1 A NPN medium power transistors
NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.
Type number | Package | PNP complement | ||
|---|---|---|---|---|
Nexperia | JEITA | JEDEC | ||
BCP55T | SOT223 | SC-73 | - | BCP52T |
BCP55-10T | BCP52-10T | |||
BCP55-16T | BCP52-16T | |||
Features and benefits
- High collector current capability IC and ICM
- Three current gain selections
- High power dissipation capability
- AEC-Q101 qualified
Applications
- Linear voltage regulators
- MOSFET drivers
- High-side switches
- Power management
- Amplifiers
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP55‑16T | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 600.0 | 60.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BCP55‑16T | BCP55‑16TF (934661088135) |
Active | P5516T |
SC‑73 (SOT223) |
SOT223 |
WAVE_BG-BD-1
|
SOT223_135 |
Series
文檔 (10)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| BCP55T_SER | 60 V, 1 A NPN medium power transistors | Data sheet | 2019-04-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| SOT223_135 | SC-73; Reel pack for SMD, 13"; Q3/T4 product orientation | Packing information | 2024-02-15 |
| BCP55-16T_Nexperia_Product_Reliability | BCP55-16T Nexperia Product Reliability | Quality document | 2025-05-27 |
| BCP55-16T | BCP55-16T SPICE model | SPICE model | 2025-07-09 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
訂購、定價與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| BCP55‑16T | BCP55‑16TF | 934661088135 | Active | SOT223_135 | 4,000 |
|
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.