Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationPXP018-30QL
30 V, P-channel Trench MOSFET
P-channel enhancement mode Field-Effect Transistor (FET) in an MLPAK33 (SOT8002) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Features and benefits
Logic level compatible
Trench MOSFET technology
MLPAK33 package (3.3 x 3.3 mm footprint)
Applications
High-side load switch
Battery management
DC-to-DC conversion
Switching circuits
參數(shù)類型
| 型號 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PXP018‑30QL | SOT8002-1 | MLPAK33 | End of life | P | 1 | -30 | 18 | 27 | 150 | -22.7 | 6.2 | 14.7 | 29.4 | 4.2 | 6 | -1.5 | N | 1420 | 160 | 2022-01-24 |
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PXP018‑30QL | PXP018‑30QLJ (934662614118) |
Discontinued / End-of-life | 8AC |
MLPAK33 (SOT8002-1) |
SOT8002-1 | SOT8002-1_118 |
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PXP018‑30QL | PXP018‑30QLJ | PXP018-30QL |
|
|
Series
文檔 (6)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PXP018-30QL | 30 V, P-channel Trench MOSFET | Data sheet | 2023-07-31 |
| AN90059 | Power MOSFET gate driver fundamentals | Application note | 2025-09-10 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8002-1 | 3D model for products with SOT8002-1 package | Design support | 2021-01-28 |
| SOT8002-1 | plastic thermal enhanced surface mounted package; mini leads; 8 terminals;pitch 0.65 mm; 3.3 x 3.3 x 0.8 mm body | Package information | 2023-05-22 |
| PXP018-30QL | PXP018-30QL SPICE model | SPICE model | 2021-03-26 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PXP018-30QL | PXP018-30QL SPICE model | SPICE model | 2021-03-26 |
| SOT8002-1 | 3D model for products with SOT8002-1 package | Design support | 2021-01-28 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.