2PA1774xMB series
40 V, 100 mA PNP general-purpose transistors
PNP general-purpose transistors in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package.
Features and benefits
Leadless ultra small SMD plastic package
Low package height of 0.37 mm
Power dissipation comparable to SOT23
AEC-Q101 qualified
Applications
General-purpose switching and amplification
Mobile applications
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2PA1774QMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250.0 | -40.0 | -100.0 | 120.0 | 270.0 | 150 | 100.0 | Y |
| 2PA1774RMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250.0 | -40.0 | -100.0 | 180.0 | 390.0 | 150 | 100.0 | Y |
| 2PA1774SMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250.0 | -40.0 | -100.0 | 270.0 | 560.0 | 150 | 100.0 | Y |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 2PA1774QMB | 2PA1774QMB,315 (934065894315) |
Active | 0100 0000 |
DFN1006B‑3 (SOT883B) |
SOT883B | SOT883B_315 | |
| 2PA1774RMB | 2PA1774RMB,315 (934065895315) |
Active | 0000 1101 |
DFN1006B‑3 (SOT883B) |
SOT883B | SOT883B_315 | |
| 2PA1774SMB | 2PA1774SMB,315 (934065896315) |
Active | 0000 1110 |
DFN1006B‑3 (SOT883B) |
SOT883B | SOT883B_315 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 2PA1774QMB | 2PA1774QMB,315 | 2PA1774QMB |
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| 2PA1774RMB | 2PA1774RMB,315 | 2PA1774RMB |
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| 2PA1774SMB | 2PA1774SMB,315 | 2PA1774SMB |
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文檔 (6)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 2PA1774XMB_SER | 40 V, 100 mA PNP general-purpose transistors | Data sheet | 2018-08-28 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT883B | 3D model for products with SOT883B package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1006B-3_SOT883B_mk | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1 mm x 0.6 mm x 0.37 mm body | Marcom graphics | 2017-01-28 |
| SOT883B | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1.0 mm x 0.6 mm x 0.37 mm body | Package information | 2022-05-20 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT883B | 3D model for products with SOT883B package | Design support | 2020-01-22 |
Ordering, pricing & availability
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