74ALVC245
Octal bus transceiver; 3-state
The 74ALVC245 is an 8-bit transceiver with 3-state outputs. The device features an output enable (OE) and send/receive (DIR) for direction control. A HIGH on OE causes the outputs to assume a high-impedance OFF-state.
Schmitt trigger action on all inputs makes the device tolerant of slow rise and fall times.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.65 V to 3.6 V
CMOS low power dissipation
Overvoltage tolerant inputs to 3.6 V
Direct interface with TTL levels
IOFF circuitry provides partial Power-down mode operation
Latch-up performance exceeds 250 mA per JESD78 Class II.A
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.5 V)
JESD8C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74ALVC245BQ | n.a. | n.a. | TTL | ± 24 | 2.3 | 8 | 130 | low | -40~85 | 77 | 49 | DHVQFN20 | |
| 74ALVC245D | n.a. | n.a. | TTL | ± 24 | 2.3 | 8 | 130 | low | -40~85 | 84 | 26 | 60 | SO20 |
| 74ALVC245PW | n.a. | n.a. | TTL | ± 24 | 2.3 | 8 | 130 | low | -40~85 | 100 | 4.4 | 44.2 | TSSOP20 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ALVC245BQ | 74ALVC245BQ,115 (935285552115) |
Active | ALVC245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74ALVC245D | 74ALVC245D,118 (935269727118) |
Active | 74ALVC245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74ALVC245PW | 74ALVC245PW,118 (935269726118) |
Active | ALVC245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ALVC245BQ | 74ALVC245BQ,115 | 74ALVC245BQ |
|
|
| 74ALVC245D | 74ALVC245D,118 | 74ALVC245D |
|
|
| 74ALVC245PW | 74ALVC245PW,118 | 74ALVC245PW |
|
|
文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74ALVC245 | Octal bus transceiver; 3-state | Data sheet | 2023-07-11 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| mna174 | Block diagram: 74AHC245D, 74AHC245PW, 74AHCT245D, 74AHCT245PW, 74LV245D, 74LV245DB, 74LV245N, 74LV245PW, 74AHC245D, 74AHC245PW, 74AHCT245D, 74AHCT245PW, 74ALVC245BQ, 74ALVC245D, 74ALVC245PW, 74LVC2245ABQ, 74LVC2245AD, 74LVC2245ADB, 74LVC2245APW, 74LVC245ABQ, 74LVC245ABX, 74LVC245AD, 74LVC245ADB, 74LVC245APW, 74LVCH245ABQ, 74LVCH245ABX, 74LVCH245AD, 74LVCH245ADB, 74LVCH245APW | Block diagram | 2009-11-04 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| alvc245 | alvc245 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| alvc245 | alvc245 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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