BSP31; BSP32; BSP33
Applications
PNP medium power transistor in a SOT223 plastic package.
NPN complements: BSP41 and BSP43.
Features and benefits
- High current (max. 1 A)
- Low voltage (max. 80 V).
Applications
- Telephony and general industrial applications.
參數(shù)類型
| 型號(hào) |
|---|
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BSP31 | BSP31,115 (933981970115) |
Discontinued / End-of-life | BSP31 |
SC‑73 (SOT223) |
SOT223 |
WAVE_BG-BD-1
|
SOT223_115 |
| BSP32 | BSP32,115 (933981980115) |
Discontinued / End-of-life | BSP32 |
SC‑73 (SOT223) |
SOT223 |
WAVE_BG-BD-1
|
SOT223_115 |
| BSP33 | BSP33,115 (933981990115) |
Discontinued / End-of-life | BSP33 |
SC‑73 (SOT223) |
SOT223 |
WAVE_BG-BD-1
|
SOT223_115 |
文檔 (8)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BSP31_32_33 | PNP medium power transistors | Data sheet | 2025-04-08 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
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