BC68PAS_series
20 V, 2 A NPN medium power transistors
NPN medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
PNP complement: BC69PAS series
Features and benefits
High collector current capability IC and ICM
Reduced Printed-Circuit Board (PCB) area requirements
Exposed heat sink for excellent thermal and electrical conductivity
AEC-Q101 qualified
Two current gain selections
Leadless very small SMD plastic package with medium power capability
Suitable for Automatic Optical Inspection (AOI) of solder joint
Applications
Linear voltage regulators
Battery driven devices
MOSFET drivers
Low-side switches
Power management
Amplifiers
參數(shù)類(lèi)型
| 型號(hào) | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BC68-25PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | NPN | 420.0 | 20.0 | 2000.0 | 160.0 | 375.0 | 150 | 40.0 |
| BC68PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | NPN | 420.0 | 20.0 | 2000.0 | 85.0 | 375.0 | 150 | 40.0 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC68-25PAS | BC68‑25PASX (934068109115) |
Active | BZ |
DFN2020D‑3 (SOT1061D) |
SOT1061D | SOT1061D_115 | |
| BC68PAS | BC68PASX (934068108115) |
Active | BY |
DFN2020D‑3 (SOT1061D) |
SOT1061D | SOT1061D_115 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BC68-25PAS | BC68‑25PASX | BC68-25PAS |
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| BC68PAS | BC68PASX | BC68PAS |
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文檔 (11)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
| AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧輕便的汽車(chē) 二極管和晶體管 | Brochure | 2022-04-26 |
| SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
| Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
| BC68PAS_Nexperia_Product_Reliability | BC68PAS Nexperia Product Reliability | Quality document | 2025-05-27 |
| BC68PAS | BC68PAS SPICE model | SPICE model | 2025-07-09 |
支持
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Ordering, pricing & availability
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