74AXP1T34
Dual supply translating buffer
The 74AXP1T34 is a dual supply translating buffer. It features one input (A), an output (Y) and dual supply pins (VCCI and VCCO). The inputs are referenced to VCCI and the output is referenced to VCCO. All inputs can be connected directly to VCCI or GND. VCCI can be supplied at any voltage between 0.7 V and 2.75 V and VCCO can be supplied at any voltage between 1.2 V and 5.5 V. This feature allows voltage level translation.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device ensures very low static and dynamic power consumption across the entire supply range and is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range:
VCCI: 0.7 V to 2.75 V
VCCO: 1.2 V to 5.5 V
Low input capacitance; CI = 0.6 pF (typical)
Low output capacitance; CO = 1.8 pF (typical)
Low dynamic power consumption; CPD = 0.4 pF at VCCI = 1.2 V (typical)
Low dynamic power consumption; CPD = 7.1 pF at VCCO = 3.3 V (typical)
Low static power consumption; ICCI = 0.5 μA (85 °C maximum)
Low static power consumption; ICCO = 1.8 μA (85 °C maximum)
High noise immunity
Complies with JEDEC standard:
JESD8-12A.01 (1.1 V to 1.3 V; A input)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
JESD8-C (2.7 V to 3.6 V; Y output)
JESD12-6 (4.5 V to 5.5 V; Y output)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2000 V
CDM JESD22-C101E exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD78D Class II
Inputs accept voltages up to 2.75 V
Low noise overshoot and undershoot < 10% of VCCO
IOFF circuitry provides partial power-down mode operation
Multiple package options
Specified from -40 °C to +85 °C
參數(shù)類型
| 型號 |
|---|
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
|
74AXP1T34GM
|
74AXP1T34GMH (935306991125) |
Withdrawn / End-of-life | rQ |
XSON6 (SOT886) |
SOT886 | SOT886_125 | |
| 74AXP1T34GN | 74AXP1T34GNH (935306992125) |
Withdrawn / End-of-life | no package information | ||||
| 74AXP1T34GS | 74AXP1T34GSH (935306993125) |
Withdrawn / End-of-life | no package information | ||||
| 74AXP1T34GW | 74AXP1T34GWH (935306994125) |
Withdrawn / End-of-life |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 | |
|
74AXP1T34GX
|
74AXP1T34GXH (935306995125) |
Withdrawn / End-of-life |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 | ||
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
|
74AXP1T34GM
|
74AXP1T34GMH | 74AXP1T34GM |
|
|
| 74AXP1T34GN | 74AXP1T34GNH | 74AXP1T34GN |
|
|
| 74AXP1T34GS | 74AXP1T34GSH | 74AXP1T34GS |
|
|
| 74AXP1T34GW | 74AXP1T34GWH | 74AXP1T34GW |
|
|
|
74AXP1T34GX
|
74AXP1T34GXH | 74AXP1T34GX |
|
|
文檔 (21)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AXP1T34 | Dual supply translating buffer | Data sheet | 2022-02-02 |
| AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| axp1t34 | 74AXP1T34 IBIS model | IBIS model | 2016-04-27 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持，請告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| axp1t34 | 74AXP1T34 IBIS model | IBIS model | 2016-04-27 |
Ordering, pricing & availability
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