BCP55T-SERIES
60 V, 1 A NPN medium power transistors
NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.
Type number | Package | PNP complement | ||
|---|---|---|---|---|
Nexperia | JEITA | JEDEC | ||
BCP55T | SOT223 | SC-73 | - | BCP52T |
BCP55-10T | BCP52-10T | |||
BCP55-16T | BCP52-16T | |||
Features and benefits
- High collector current capability IC and ICM
- Three current gain selections
- High power dissipation capability
- AEC-Q101 qualified
Applications
- Linear voltage regulators
- MOSFET drivers
- High-side switches
- Power management
- Amplifiers
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP55-10T | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 600.0 | 60.0 | 1000.0 | 63.0 | 160.0 | 150 | 100.0 |
| BCP55-16T | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 600.0 | 60.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 |
| BCP55T | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 600.0 | 60.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BCP55-10T | BCP55-10TF (934661087135) |
Active | P5510T |
SC-73 (SOT223) |
SOT223 |
WAVE_BG-BD-1
|
SOT223_135 |
| BCP55-16T | BCP55-16TF (934661088135) |
Active | P5516T |
SC-73 (SOT223) |
SOT223 |
WAVE_BG-BD-1
|
SOT223_135 |
| BCP55T | BCP55TF (934661086135) |
Active | BCP55T |
SC-73 (SOT223) |
SOT223 |
WAVE_BG-BD-1
|
SOT223_135 |
文檔 (7)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BCP55T_SER | 60 V, 1 A NPN medium power transistors | Data sheet | 2019-04-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
樣品
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