XC7SH14
Inverting Schmitt trigger
XC7SH14 is a high-speed Si-gate CMOS device. It provides an inverting buffer function with Schmitt trigger action. This device is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
Features and benefits
Symmetrical output impedance
High noise immunity
Low power dissipation
CMOS input levels
Balanced propagation delays
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Applications
Wave and pulse shapers
Astable multivibrators
Monostable multivibrators
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7SH14GV | 2.0?-?5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 282 | 62 | 177 | TSOP5 |
| XC7SH14GW | 2.0?-?5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 322 | 90.7 | 191 | TSSOP5 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| XC7SH14GV | XC7SH14GV,125 (935289917125) |
Active | f14 |
TSOP5 (SOT753) |
SOT753 |
WAVE_BG-BD-1
|
SOT753_125 |
| XC7SH14GW | XC7SH14GW,125 (935289918125) |
Active | fF |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| XC7SH14GV | XC7SH14GV,125 | XC7SH14GV |
|
|
| XC7SH14GW | XC7SH14GW,125 | XC7SH14GW |
|
|
文檔 (12)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| XC7SH14 | Inverting Schmitt trigger | Data sheet | 2024-01-03 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| xc7sh14 | xc7sh14 IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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