74AHC30; 74AHCT30
8-input NAND gate
The 74AHC30; 74AHCT30 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.
The 74AHC30; 74AHCT30 provides an 8-input NAND function.
Features and benefits
Balanced propagation delays
All inputs have Schmitt-trigger actions
Inputs accept voltages higher than VCC
Input levels:
For 74AHC30: CMOS level
For 74AHCT30: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC30BQ | 2.0?-?5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 108 | 22.7 | 76 | DHVQFN14 |
| 74AHC30BZ | 2.0?-?5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | DHXQFN14 | |||
| 74AHC30D | 2.0?-?5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 111 | 21.9 | 69 | SO14 |
| 74AHC30GU12 | 2.0?-?5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | XQFN12 | |||
| 74AHC30PW | 2.0?-?5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 143 | 8.5 | 69 | TSSOP14 |
| 74AHCT30BQ | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 108 | 22.7 | 76 | DHVQFN14 |
| 74AHCT30BZ | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | DHXQFN14 | |||
| 74AHCT30D | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 111 | 21.9 | 69 | SO14 |
| 74AHCT30PW | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 143 | 8.5 | 69 | TSSOP14 |
封裝
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC30BQ | 74AHC30BQ,115 | 74AHC30BQ |
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| 74AHC30BZ | 74AHC30BZZ | 74AHC30BZ |
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| 74AHC30D | 74AHC30D,118 | 74AHC30D |
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| 74AHC30GU12 | 74AHC30GU12X | 74AHC30GU12 |
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| 74AHC30PW | 74AHC30PW,118 | 74AHC30PW |
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| 74AHCT30BQ | 74AHCT30BQ,115 | 74AHCT30BQ |
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| 74AHCT30BZ | 74AHCT30BZZ | 74AHCT30BZ |
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| 74AHCT30D | 74AHCT30D,118 | 74AHCT30D |
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| 74AHCT30PW | 74AHCT30PW,118 | 74AHCT30PW |
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文檔 (23)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT30 | 8-input NAND gate | Data sheet | 2025-04-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| mna490 | Block diagram: 74AHC30BQ, 74AHC30D, 74AHC30PW, 74AHCT30BQ, 74AHCT30D, 74AHCT30PW | Block diagram | 2009-11-03 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT8014-1 | 3D model for products with SOT8014-1 package | Design support | 2023-02-02 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc30 | 74AHC30 IBIS model | IBIS model | 2015-08-30 |
| ahct30 | 74AHCT30 IBIS model | IBIS model | 2015-08-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2024-04-11 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT8014-1 | 3D model for products with SOT8014-1 package | Design support | 2023-02-02 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT1174-1 | 3D model for products with SOT1174-1 package | Design support | 2021-01-28 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc30 | 74AHC30 IBIS model | IBIS model | 2015-08-30 |
| ahct30 | 74AHCT30 IBIS model | IBIS model | 2015-08-30 |
Ordering, pricing & availability
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