74LVT244A-Q100; 74LVTH244A-Q100
3.3 V octal buffer/line driver; 3-state
The 74LVT244A-Q100; 74LVTH244A-Q100 is a high-performance BiCMOS product designed for VCC operation at 3.3 V.
This device is an octal buffer that is ideal for driving bus lines. The device features two output enables (1OE, 2OE), each controlling four of the 3-state outputs.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 3) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 3)
Specified from -40 °C to +85 °C
Octal bus interface
3-state buffers
Output capability: +64 mA and -32 mA
Wide supply voltage range from 2.7 V to 3.6 V
Overvoltage tolerant inputs to 5.5 V
Direct interface with TTL levels
BiCMOS high speed and output drive
IOFF circuitry provides partial Power-down mode operation
Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
Live insertion and extraction permitted
Power-up 3-state
No bus current loading when output is tied to 5 V bus
Latch-up performance exceeds 500 mA per JESD 78 Class II Level B
Complies with JEDEC standard JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVT244ABQ-Q100 | 2.7?-?3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 77 | 7.9 | 48 | DHVQFN20 |
| 74LVT244AD-Q100 | 2.7?-?3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 84 | 26.3 | 60 | SO20 |
| 74LVT244APW-Q100 | 2.7?-?3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 100 | 4.4 | 44 | TSSOP20 |
| 74LVTH244ABQ-Q100 | 2.7?-?3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 77 | 7.9 | 48 | DHVQFN20 |
| 74LVTH244AD-Q100 | 2.7?-?3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 84 | 26.3 | 60 | SO20 |
| 74LVTH244APW-Q100 | 2.7?-?3.6 | TTL | -0.5 | 150 | 8 | medium | -40~85 | 100 | 4.4 | 44 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVT244ABQ-Q100 | 74LVT244ABQ‑Q100X (935302078115) |
Active | LVT244A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74LVT244AD-Q100 | 74LVT244AD‑Q100J (935300469118) |
Active | 74LVT244AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74LVT244APW-Q100 | 74LVT244APW‑Q100J (935300471118) |
Active | LVT244A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74LVTH244ABQ-Q100 | 74LVTH244ABQ‑Q100X (935302077115) |
Active | LVTH244A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74LVTH244AD-Q100 | 74LVTH244AD‑Q100J (935301623118) |
Active | 74LVTH244AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74LVTH244APW-Q100 | 74LVTH244APW‑Q100J (935301624118) |
Active | VTH244A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVT244ABQ-Q100 | 74LVT244ABQ‑Q100X | 74LVT244ABQ-Q100 |
|
|
| 74LVT244AD-Q100 | 74LVT244AD‑Q100J | 74LVT244AD-Q100 |
|
|
| 74LVT244APW-Q100 | 74LVT244APW‑Q100J | 74LVT244APW-Q100 |
|
|
| 74LVTH244ABQ-Q100 | 74LVTH244ABQ‑Q100X | 74LVTH244ABQ-Q100 |
|
|
| 74LVTH244AD-Q100 | 74LVTH244AD‑Q100J | 74LVTH244AD-Q100 |
|
|
| 74LVTH244APW-Q100 | 74LVTH244APW‑Q100J | 74LVTH244APW-Q100 |
|
|
文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVT_LVTH244A_Q100 | 3.3 V octal buffer/line driver; 3-state | Data sheet | 2024-07-08 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvt244a | lvt244a IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvt244a | lvt244a IBIS model | IBIS model | 2013-04-09 |
Ordering, pricing & availability
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