74HC164-Q100; 74HCT164-Q100
8-bit serial-in, parallel-out shift register
The 74HC164-Q100; 74HCT164-Q100 is an 8-bit serial-in/parallel-out shift register. The device features two serial data inputs (DSA and DSB), eight parallel data outputs (Q0 to Q7). Data is entered serially through DSA or DSB and either input can be used as an active HIGH enable for data entry through the other input. Data is shifted on the LOW-to-HIGH transitions of the clock (CP) input. A LOW on the master reset input (MR) clears the register and forces all outputs LOW, independently of other inputs. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
High noise immunity
Input levels:
For 74HC164-Q100: CMOS level
For 74HCT164-Q100: TTL level
Gated serial data inputs
Asynchronous master reset
Complies with JEDEC standards
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC164BQ-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | 78 | low | -40~125 | 105 | 20.1 | 73 | DHVQFN14 |
| 74HC164D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | 78 | low | -40~125 | 107 | 19.4 | 65 | SO14 |
| 74HC164PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | 85 | low | -40~125 | 140 | 7.5 | 66 | TSSOP14 |
| 74HCT164BQ-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | 78 | low | -40~125 | 105 | 20.1 | 73 | DHVQFN14 |
| 74HCT164D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 20 | 55 | low | -40~125 | 107 | 19.4 | 65 | SO14 |
| 74HCT164PW-Q100 | 4.5?-?5.5 | TTL | ± 4 | 20 | 55 | low | -40~125 | 140 | 7.5 | 66 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC164BQ-Q100 | 74HC164BQ‑Q100X (935302777115) |
Active | HC164 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74HC164D-Q100 | 74HC164D‑Q100J (935300442118) |
Active | 74HC164D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HC164PW-Q100 | 74HC164PW‑Q100J (935300443118) |
Active | HC164 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74HCT164BQ-Q100 | 74HCT164BQ‑Q100X (935302778115) |
Active | HT164 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74HCT164D-Q100 | 74HCT164D‑Q100J (935300447118) |
Active | 74HCT164D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HCT164PW-Q100 | 74HCT164PW‑Q100J (935300448118) |
Active | HCT164 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC164BQ-Q100 | 74HC164BQ‑Q100X | 74HC164BQ-Q100 |
|
|
| 74HC164D-Q100 | 74HC164D‑Q100J | 74HC164D-Q100 |
|
|
| 74HC164PW-Q100 | 74HC164PW‑Q100J | 74HC164PW-Q100 |
|
|
| 74HCT164BQ-Q100 | 74HCT164BQ‑Q100X | 74HCT164BQ-Q100 |
|
|
| 74HCT164D-Q100 | 74HCT164D‑Q100J | 74HCT164D-Q100 |
|
|
| 74HCT164PW-Q100 | 74HCT164PW‑Q100J | 74HCT164PW-Q100 |
|
|
文檔 (18)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT164_Q100 | 8-bit serial-in, parallel-out shift register | Data sheet | 2024-05-28 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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