74HC166-Q100; 74HCT166-Q100
8-bit parallel-in/serial out shift register
The 74HC166-Q100; 74HCT166-Q100 is an 8-bit serial or parallel-in/serial-out shift register. The device features a serial data input (DS), eight parallel data inputs (D0 to D7) and a serial output (Q7). When the parallel enable input (PE) is LOW, the data from D0 to D7 is loaded into the shift register on the next LOW-to-HIGH transition of the clock input (CP). When PE is HIGH, data enters the register serially at DS with each LOW-to-HIGH transition of CP. When the clock enable input (CE) is LOW data is shifted on the LOW-to-HIGH transitions of CP. A HIGH on CE disables the CP input. Inputs include clamp diodes which enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Synchronous parallel-to-serial applications
Synchronous serial input for easy expansion
Input levels:
For 74HC166-Q100: CMOS level
For 74HCT166-Q100: TTL level
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC166D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 15 | 63 | low | -40~125 | 74 | 1.2 | 32 | SO16 |
| 74HC166PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 15 | 63 | low | -40~125 | 108 | 1 | 35.9 | TSSOP16 |
| 74HCT166D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 23 | 50 | low | -40~125 | 76 | 2.1 | 34 | SO16 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC166D-Q100 | 74HC166D‑Q100J (935301535118) |
Active | 74HC166D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC166PW-Q100 | 74HC166PW‑Q100J (935301536118) |
Active | HC166 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT166D-Q100 | 74HCT166D‑Q100J (935301537118) |
Active | 74HCT166D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC166D-Q100 | 74HC166D‑Q100J | 74HC166D-Q100 |
|
|
| 74HC166PW-Q100 | 74HC166PW‑Q100J | 74HC166PW-Q100 |
|
|
| 74HCT166D-Q100 | 74HCT166D‑Q100J | 74HCT166D-Q100 |
|
|
文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT166_Q100 | 8-bit parallel-in/serial out shift register | Data sheet | 2024-03-11 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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